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BM64

Status: In Production

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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The BM64 stereo audio module is a fully-certified Bluetooth  module for designers who want to add Bluetooth wireless audio and voice applications to their products.

This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package.  This stereo module has integrated Li-Ion charger and contains a digital audio interface.  It supports HSP, HFP, SPP, A2DP, and AVRCP profiles.  Both AAC and SBC codecs are supported for A2DP.

Bluetooth Low Energy supports standard Generic Access Service, Device Information Service and a proprietary service for data communication.

Note: The BM64 module supports two versions of firmware for single-speaker applications: DSPK version 1.1 and 2.1. Modules are pre-programmed with DSPK v1.1. See the tools package under the Documentation tab for new features and instructions on how to upgrade from version 1.1 to 2.1.

Microchip’s Wireless Concert Technology (WCT) for speakers uses Multi-Speaker (MSPK) firmware to stream A2DP music to multiple speakers from one audio source, such as a smartphone. This unique solution delivers tight synchronization among the speakers with less than 0.3 ms of uninterrupted, distributed audio. Use personal sharing groups to easily pair speakers and assign master and slave roles via the Microchip Bluetooth Audio (MBA) Mobile app. For more information about multi-speaker applications, contact your local Microchip sales representative.

Additional Features
  • Bluetooth 5 Certified
  • On-board Bluetooth Stack
  • Class 2 module with +2 dBm (typical) output power and Class 1 module with +15 dBm (typical) output power
  • Transparent UART mode for seamless serial data over UART interface
  • Easy to configure with User Interface (UI) tool, a Windows® configuration utility or directly by MCU
  • USB firmware upgrade supported
  • Supports both digital audio I2S format and analog audio output
  • Compact surface mount module:  32 x 15 x 2.5 mm3
  • Castellated surface mount pads for easy and reliable host PCB mounting
  • RoHS compliant
  • Ideal for portable battery-operated devices
  • Internal battery regulator circuitry
  • On-board antenna
  • FCC, Canada (IC), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (JRF), and China (SRRC) certified
Parametrics
Name
Value
Bluetooth Classic-Data/SPP
Yes
Bluetooth Classic-Audio
Yes
Bluetooth Low Energy
Yes
FCC Certified
Yes
No-shield Option
Yes
Audio Channels
Stereo
Analog Audio Out
Yes
Digital Audio Out
Yes
MIC-in
1
Line-in
Yes
Memory Type
Flash
GPIO
12
Pin Count
43
Package Type
Surface mount module
Package Size
32 x 15 x 2.5 mm
Min Temp Range
-20 C
Max Temp Range
+70 C
Op Voltage Min
3.2 V
Op Voltage Max
4.2 V

Documents

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Data Sheet

09/11/2018
5283KB

Certifications

Design Checklist

Brochures

10/17/2017
746KB

User Guides

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
BM64 Bluetooth Audio Evaluation Board
BM64 Bluetooth Audio Evaluation Board ( BM-64-EVB-C1 )

The BM-64-EVB-C1 enables the user to evaluate and demonstrate the functionality of the BM64 Class 1 stereo audio module. The BM-64-EVB-C1 includes an integrated configuration and programming interface for plug-and-play capability, and also has status LEDs which enable rapid prototyping and faster time to market.

Along with the BM-64-EVB-C1, software tools and applications are...

Learn More
Add To Cart
BM64 Bluetooth Audio Evaluation Board
BM64 Bluetooth Audio Evaluation Board ( BM-64-EVB-C2 )

The BM-64-EVB-C2 enables the user to evaluate and demonstrate the functionality of the BM64 Class 2 stereo audio module. The BM-64-EVB-C2 includes an integrated configuration and programming interface for plug-and-play capability, and also has status LEDs which enable rapid prototyping and faster time to market.

Along with the BM-64-EVB-C2, software tools and applications are...

Learn More
Add To Cart

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
BM64SPKA1MC1-0001AA
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
BM64SPKA1MC2-0001AA
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
BM64SPKS1MC1-0001AA
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
BM64SPKS1MC2-0001AA
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
BM64SPKS1MC1-00M2AA
3.571429
43
MODULE
32x15x2.5mm
NiAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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