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ATSAM3U1C

Status: In Production

Features:

  • ARM Cortex-M3 revision 2.0 running at up to 96 MHz
  • Memory Protection Unit (MPU)
  • Thumb®-2 instruction set
  • 64 Kbytes Dual Plane embedded Flash, 128-bit wide access, memory accelerator, dual bank
  • 20 Kbytes embedded SRAM
  • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
  • Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash controller with 4 Kbytes RAM buffer and ECC
  • External Bus Interface - 8 or 16 bits, 4 chip selects, 24-bit address
  • Embedded voltage regulator for single-supply operation
  • POR, BOD and Watchdog for safe reset
  • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock
  • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup
  • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode
  • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device
  • 17 Peripheral DMA Controller (PDC) channels and 4-channel central DMA
  • Sleep, Wait, and Backup modes, down to 1.65 μA in Backup mode with RTC, RTT, and GPBR
  • 100-lead LQFP – 14 × 14 mm, pitch 0.5 mm
  • 100-ball TFBGA – 9 × 9 mm, pitch 0.8 mm
  • Industrial (-40° C to +85° C)
  • USB 2.0 Device: 480 Mbps, 4-Kbyte FIFO, up to 7 bidirectional Endpoints, dedicated DMA
  • 3 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester support) and one UART
  • 2 TWI (I2C compatible)
  • 1 Serial Perpheral Interface (SPI)
  • 1 Synchronous Serial Controller (SSC) (I2S)
  • 1 High Speed Multimedia Card Interface (HSMCI) (SDIO/SD/MMC)
  • 3-channel 16-bit Timer/Counter (TC) for capture, compare and PWM
  • 4-channel 16-bit PWM (PWMC)
  • 32-bit Real-time Timer (RTT) and Real-time Clock (RTC) with calendar and alarm features
  • 57 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination
  • Three 32-bit Parallel Input/Output Controllers
  • 4-channel 12-bit 1 msps ADC with differential input mode and programmable gain stage
  • 4-channel 10-bit ADC
  • Serial Wire/JTAG Debug Port(SWJ-DP)
  • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.
  • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.
  • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.
  • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.
  • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.
  • IEEE1149.1 JTAG Boundary-scan on all digital pins.
  • ASF-Atmel software Framework – SAM software development framework
  • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.
  • DMA support, Interrupt handlers Driver support
  • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks
  • RTOS integration, FreeRTOS is a core component
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Overview
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Device Overview

Summary

Microchip's ARM®-based SAM3U1C is a member of the SAM3U family of flash microcontrollers based on the high-performance 32-bit ARM Cortex®-M3 RISC processor.

It operates at a maximum speed of 96MHz and features 64KB of flash memory and 20KB of SRAM.

The peripheral set includes a High Speed USB device and PHY at 480Mbps, high-speed multimedia card interface for SDIO/SD/MMC, a 16-bit external bus interface supporting NAND flash, three USARTs, TWI (I2C), four SPIs, I2S, four PWM timers, three 16-bit timers, RTC, four 12-bit and four 10-bit ADCs.

The architecture is designed to sustain high-speed data transfers. The multi-layer bus matrix, multiple SRAM banks, PDC, and DMA support parallel tasks and maximize data throughput.

The SAM3U1C operates from 1.62V to 3.6V and is available in 100-pin LQFP and BGA packages.

Additional Features

    Core

    • ARM Cortex-M3 revision 2.0 running at up to 96 MHz

    • Memory Protection Unit (MPU)

    • Thumb®-2 instruction set

    Memories

    • 64 Kbytes Dual Plane embedded Flash, 128-bit wide access, memory accelerator, dual bank

    • 20 Kbytes embedded SRAM

    • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines

    • Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash controller with 4 Kbytes RAM buffer and ECC

    • External Bus Interface - 8 or 16 bits, 4 chip selects, 24-bit address

    System

    • Embedded voltage regulator for single-supply operation

    • POR, BOD and Watchdog for safe reset

    • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock

    • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup

    • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode

    • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device

    • 17 Peripheral DMA Controller (PDC) channels and 4-channel central DMA

    Low Power modes

    • Sleep, Wait, and Backup modes, down to 1.65 μA in Backup mode with RTC, RTT, and GPBR

    Package

    • 100-lead LQFP – 14 × 14 mm, pitch 0.5 mm

    • 100-ball TFBGA – 9 × 9 mm, pitch 0.8 mm

    Temperature operating range

    • Industrial (-40° C to +85° C)

    Peripheral Features

    • USB 2.0 Device: 480 Mbps, 4-Kbyte FIFO, up to 7 bidirectional Endpoints, dedicated DMA

    • 3 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester support) and one UART

    • 2 TWI (I2C compatible)

    • 1 Serial Perpheral Interface (SPI)

    • 1 Synchronous Serial Controller (SSC) (I2S)

    • 1 High Speed Multimedia Card Interface (HSMCI) (SDIO/SD/MMC)

    • 3-channel 16-bit Timer/Counter (TC) for capture, compare and PWM

    • 4-channel 16-bit PWM (PWMC)

    • 32-bit Real-time Timer (RTT) and Real-time Clock (RTC) with calendar and alarm features

    I/O

    • 57 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination

    • Three 32-bit Parallel Input/Output Controllers

    Analog Features

    • 4-channel 12-bit 1 msps ADC with differential input mode and programmable gain stage

    • 4-channel 10-bit ADC

    Debugger Development Support

    • Serial Wire/JTAG Debug Port(SWJ-DP)

    • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.

    • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.

    • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.

    • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.

    • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.

    • IEEE1149.1 JTAG Boundary-scan on all digital pins.

    Integrated Software Libraries and Tools

    • ASF-Atmel software Framework – SAM software development framework

    • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.

    • DMA support, Interrupt handlers Driver support

    • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks

    • RTOS integration, FreeRTOS is a core component

Parametrics
Name
Value
Part Family
ATSAM3U1C
Max CPU Speed MHz
96
Program Memory Size (KB)
64
SRAM (KB)
20
SDIO/SD-CARD/eMMC
1
Temperature Range (C)
-40 to 85
Operating Voltage Range (V)
1.62 to 3.6
Direct Memory Access Channels
21
SPI
4
I2C
1
Peripheral Pin Select / Pin Muxing
Yes
Number of USB Modules
1
ADC Input
8
Max ADC Resolution (Bits)
12
Max ADC Sampling Rate (ksps)
1000
Input Capture
6
Max 16-bit Digital Timers
3
Parallel Port
EBI
Internal Oscillator
4,8,12Mhz,32Khz
Hardware RTCC/RTC
Yes
Max I/O Pins
57
Pincount
100
Quadrature Encoder Interface
1

Documents

Jump to:

Data Sheet

04/01/2015
4719KB

Application Notes

Download All

Product Document

01/01/2010
411KB

White Papers

05/01/2013
443KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAM3U1CB-AU
0.580400
6.666667
100
LQFP
14x14x1.4mm
Matte Tin
e3
ATSAM3U1CB-CU
0.139600
0.696154
100
TFBGA
9x9x1.2mm
SAC105
e8
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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