Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

AN1419

Title:
Adding Flexibility by Using Multiple Footprints for SPI Serial EEPROMs
Name:
AN1419
Date:
12/07/2011
Author:
Chris Parris
Description:
For many years the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more commonplace. This offers a number of benefits; the reductions in footprint size and component height are some of the more obvious ones. Similar packages also generally offer a cost advantage over their larger counterparts.
Keywords:
AN1419, SPI, serial EEPROM, footprints, flexibility
 
Application Notes & Source Code
 Last Updated
Size
 
  AN1419
  12/07/2011
  282KB
Silicon Products