Adding Flexibility by Using Multiple Footprints for SPI Serial EEPROMs
For many years the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more commonplace. This offers a number of benefits; the reductions in footprint size and component height are some of the more obvious ones. Similar packages also generally offer a cost advantage over their larger counterparts.
AN1419, SPI, serial EEPROM, footprints, flexibility