Adding Flexibility by Using Multiple Footprints for I2C Serial EEPROMs
For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more commonplace. This offers a number of benefits; the reductions in footprint size and component height are some of the more obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.
AN1418, footprints, serial EEPROM, I2C