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AN1418

Title:
Adding Flexibility by Using Multiple Footprints for I2C Serial EEPROMs
Name:
AN1418
Date:
11/28/2011
Author:
Chris Parris
Description:
For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more commonplace. This offers a number of benefits; the reductions in footprint size and component height are some of the more obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.
Keywords:
AN1418, footprints, serial EEPROM, I2C
 
Application Notes & Source Code
 Last Updated
Size
 
  AN1418
  11/28/2011
  378KB
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