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AN598

Download Application Note
Title
Title
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
Name
Name
AN598
Date
Date
06/24/2015
Application Categories
Application Categories
Functional Enablement / Human Interface
Product Categories
Product Categories
16-bit MCUs
dsPIC DSCs
Description
Description
This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices (SMD?s). The process of packaging a semiconductor in plastic brings to pass a somewhat unlikely marriage of different materials. In order to minimize potential adverse effects of surface mount solder techniques, it is worthwhile to understand the interaction of the package materials during the time they are subjected to thermal stress. Understanding both the limits of thermal stressing that SMD?s can withstand and how those stresses interact to produce failures are crucial to successfully maintaining reliability in the finished product. A recommended Infrared (IR) solder profile is provided as a reference later.