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AN2090
| Title |
Title
Package Application Note for TLA Packages
|
|---|---|
| Name |
Name
AN2090
|
| Date |
Date
01/29/2016
|
| Description |
Description
This package application note provides the guidelines for the handling and assembly of Microchip TLA packages during the Printed Circuit Board (PCB) assembly. In addition, it provides general information for the PCB land pattern design and component rework guidelines.
|