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AN2088

Download Application Note
Title
Title
Package Application Note for LGA Packages
Name
Name
AN2088
Date
Date
01/29/2016
Description
Description
This package application note provides the guidelines for the handling and assembly of Microchip fine pitch LGA packages during the Printed Circuit Board (PCB) assembly. In addition, it provides general information for the PCB land pattern design and component rework guidelines.