Product Roundup: September 2026

Microchip Introduces New Wireless PIC32-BZ6 System-on-Chip

The PIC32CX2051BZ66048 System-on-Chip (SoC) and PIC32WM-BZ6602CE module expand Microchip’s PIC32 BZ6 family with smaller 48-pin options for designs that need integrated wireless connectivity in a more compact footprint. These new variants provide a subset of the larger 132-pin PIC32 BZ6 devices and boast key capabilities for connected embedded applications, including CAN-FD, motor control peripherals and touch functionality. The devices are well suited for space-constrained connected products that benefit from wireless connectivity, real-time control and mixed-signal integration.

The PIC32CX2051BZ66048 SoC includes 37 GPIO, giving designers flexibility for compact, cost-optimized board designs. The PIC32WM-BZ6602CE module further simplifies development with 29 GPIO and an integrated chip antenna, helping reduce RF design complexity and accelerate time to market. Together, these devices make it easier to scale PIC32 BZ6-based designs across different product sizes, feature requirements and integration levels, while maintaining a common development path within the family. 

Enhanced Radiation Tolerance and Quality Assurance for Space Applications, SAMV71Q21RT-H8X-SP

The SAMV71Q21RT-H8X-SP is a radiation-tolerant Arm^® Cortex^®-M7 microcontroller designed for demanding space applications. Based on the proven SAMV71 architecture, this enhanced version offers a Total Ionizing Dose (TID) capability of 50 krad and a qualification flow equivalent to QML-P, providing increased confidence for long-duration and high-reliability missions. The device combines high processing performance, integrated memory, advanced communication interfaces and low-power operation in a compact solution suitable for spacecraft avionics, payload control and platform management functions. The SAMV71Q21RT-H8X-SP enables designers to leverage a modern 32-bit MCU architecture while benefiting from an improved radiation and quality assurance profile tailored for New Space and traditional space programs.

High-Performance High-Density Power Module

The MCP1606A is a fully integrated and highly efficient 6A point-of-load voltage regulator module. The device incorporates an on-chip pulse-width modulation (PWM) controller, integrated MOSFETs, and built-in inductors and capacitors, resulting in a compact and precise solution. Its low-profile package is optimized for automated assembly using standard surface-mount equipment; available in a 3.3 mm x 3.3 mm x 1.35 mm (LLGA) package with an operating junction temperature range from −40°C to +125°C.  Additionally, the MCP1606A supports programmable operation via I²C protocol and protection features including pre-biased start-up, soft-start protection, overvoltage protection, thermally compensated overcurrent protection with hiccup mode and thermal shutdown with auto-recovery.

Family of 1200V mSiC® MOSFET Devices Offered in QDPAK Top-Side Cooled Surface-Mount Package

Microchip's mSiC^® 1200V MOSFET family is now available in the QDPAK top-side cooled surface-mount package. The family includes seven devices ranging from 20 mω to 80 mω RDS(on), letting designers scale power while maintaining a common PCB footprint. The QDPAK package provides a direct thermal path from the device to an external heatsink, reducing thermal stress on the PCB and enabling higher power density. Combined with low parasitic inductance and improved switching performance, the family helps customers improve efficiency, simplify manufacturing, and accelerate time to market. Available in both industrial and AEC-Q101-qualified options, these devices are well suited for demanding high-power applications. The QDPAK top-side cooled package delivers improved thermal performance, lower parasitic inductance, higher power density and compatibility with an emerging industry-standard footprint, simplifying adoption and multi-source design strategies.

USB 3.2 Gen 1 Relocker/Redriver Devices Target Automotive, Robotics and Industrial Automation

The newest release of Microchip’s USB 3.2 Relocker/Redriver devices include the EQCO5X31 and EQCO510, designed to extend high-speed USB connectivity beyond traditional distance limitations while maintaining reliable signal integrity. These single-chip solutions integrate signal conditioning and EyeOpen™ cable compensation equalization technology to compensate for signal loss across longer cables, traces and connectors making them optimal for automotive, industrial and embedded applications. The devices support robust USB communication in harsh operating environments where electromagnetic interference, vibration and temperature extremes can impact performance. By simplifying long-distance USB implementation, Microchip USB relocker/redriver devices help reduce design complexity, improve system reliability and support scalable next-generation embedded architectures. Applications include automotive infotainment systems, ADAS cameras, industrial automation, machine vision, robotics and embedded computing platforms.

PolarFire^® SoC Motor Control Kit

The PolarFire^® SoC Motor Control Kit is a complete development platform for evaluating and developing high-performance motor-control applications using the MPFS095T PolarFire SoC FPGA. It supports sensor and sensorless Field-Oriented Control (FOC) for BLDC motors, combining deterministic FPGA-based motor control with a Linux^®-capable RISC-V^® processor subsystem. The platform includes motor-control IP, real-time current and voltage sensing, configurable control loops, motor and sensor interfaces, TSN-ready GbE, a browser-based monitoring and control GUI, as well as supporting software, BSPs and reference designs. The architecture can scale to control up to 40 motors from a single device, making it particularly suited to synchronized multi-axis systems, industrial drives and servo systems, factory automation, robotic joints and actuators, autonomous/mobile robots and aerospace motion-control systems.

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