Status: In Production
This third generation of
WinPath® products builds upon hundreds of successful customer communications
system deployments and leverages the broad set of supplied protocols developed
for WinPath1 and WinPath2. These protocols include support for L2 and L3
termination (including Ethernet, ML-PPP, IMA, CES), PWE3 (for Ethernet, TDM,
HDLC, ATM), Packet Network Synchronization (IEEE 1588v2, Synchronous Ethernet,
adaptive and differential clock recovery), interworking (MPLS, IPv4/IPv6
Routing, VLAN-aware bridging), OAM (for Ethernet and ATM), QoS (policing,
shaping, per-flow queuing, WRED) and many others.
WinPath3 integrates control plane and enhanced data plane processing components. Control plane processing is based on two high performance MIPS 34K multi-threaded processors.
Data plane processing uses new hardware accelerators for packet classification, hierarchical shaping, additional security standards and more which have been added to off-load common processing tasks. These accelerators are flexibly combined with Microsemi's field-proven, fully-programmable, high performance, multi-threaded WinComm multi-core data path processor subsystem. The available number of cores in WinComm has increased from six to twelve along with increases in operating speed.
Development tools data is currently unavailable.
For pricing and availability, contact Microchip Local Sales.