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USBF129

USB Hub Firmware Memory

Status: In Production

Features:

  • Preprogrammed with binary image129 for automotive usage. See “FlexConnect Firmware for USB84604” application note for complete feature set
  • Integration with head unit systems
  • First, second, and third row USB media hubs 
  • 512 KByte (4 Mbit) memory size
  • Single Voltage Read and Write Operations- 2.7–3.6V
  • Serial Interface Architecture- SPI Compatible: Mode 0 and Mode 3
  • Read Support: Dual Input/Output I/O
  • High Speed Clock Frequency up to 30 MHz
  • Endurance: 100,000 Cycles (typical)
  • Greater than 20 years Data Retention
  • Active Read Current: 5 mA (typical)
  • Standby Current: 5 µA (typical) 
  • Power-down Mode: 3µA (typical)
  • Uniform 4 KByte sectors
  • Uniform 64 KByte overlay blocks
  • Sector-Erase Time: 40 ms (typical)
  • Byte-Program Time: 4 ms/256 bytes (typical)
  • Page Program Mode - 256 Bytes/Page
  • End-of-Write Detection- Software polling the BUSY bit in Status Register
  • Hold Pin (HOLD#)- Suspends a serial sequence to the memorywithout deselecting the device
  • Write Protection (WP#)- Enables/Disables the Lock-Down function of the status register
  • Software Write Protection- Write protection through Block-Protection bits instatus register
  • Automotive grade 3: -40°C to +85°C
  • 8-lead SOIC (150 mils)
  • All devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

USBF129, a USB Firmware memory chip, is a companion to the Microchip Automotive USB Smart Hub devices: USB84604 and USB84602. It is factory pre-programmed with version 129 of the binary firmware, which contains application firmware and default hub configuration settings. The USBF129 memory function assures proper functionality, providing for decreased development time and engineering resource, and overall faster time to market. Full custom programming alternatives are available upon request. 

The USB Firmware memory family features a four-wire, SPI-compatible interface that allows for a low pin-count package, which occupies less board space and ultimately lowers total system costs. It is manufactured with proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.

Additional Features
    • Preprogrammed with binary image129 for automotive usage. See “FlexConnect Firmware for USB84604” application note for complete feature set
    • Targeted for USB 2.0 High-Speed infotainment applications including:
      • Integration with head unit systems
      • First, second, and third row USB media hubs 
    • 512 KByte (4 Mbit) memory size
    • Single Voltage Read and Write Operations- 2.7–3.6V
    • Serial Interface Architecture- SPI Compatible: Mode 0 and Mode 3
    • Read Support: Dual Input/Output I/O
    • High Speed Clock Frequency up to 30 MHz
    • Superior Reliability:
      • Endurance: 100,000 Cycles (typical)
      • Greater than 20 years Data Retention
    • Low Power Consumption:
      • Active Read Current: 5 mA (typical)
      • Standby Current: 5 µA (typical) 
      • Power-down Mode: 3µA (typical)
    • Flexible Erase Capability 
      • Uniform 4 KByte sectors
      • Uniform 64 KByte overlay blocks
    • Fast Erase and Byte-Program: 
      • Sector-Erase Time: 40 ms (typical)
      • Byte-Program Time: 4 ms/256 bytes (typical)
    • Page Program Mode - 256 Bytes/Page
    • End-of-Write Detection- Software polling the BUSY bit in Status Register
    • Hold Pin (HOLD#)- Suspends a serial sequence to the memorywithout deselecting the device
    • Write Protection (WP#)- Enables/Disables the Lock-Down function of the status register
    • Software Write Protection- Write protection through Block-Protection bits instatus register
    • Automotive grade 3: -40°C to +85°C
    • Packages Available- 
      • 8-lead SOIC (150 mils)
    • All devices are RoHS compliant
Parametrics
Name
Value
Density
512 KByte
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
30 MHz
Page Size (bytes)
256
Temp Range (°C)
-40°C to +85°C
Endurance
100,000
Data Retention (Years)
20
Bus Modes
SPI,SDI

Documents

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Data Sheets

11/27/2018
1664KB

Development Environment

  • Programmers
Programmers
MPLAB PM3 Universal Device Programmer
MPLAB PM3 Universal Device Programmer ( DV007004 )

The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

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Memory Speed
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Price 5K
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$0.74
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
USBF129-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
USBF129-I/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
USBF129T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
USBF129T-I/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
USBF129T-V/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
USBF129-V/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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