Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
  • product video
product primary image

SST39VF1602

Status: Not Recommended for new designs

Features:

  • Organized as 1M x16: SST39VF1601/1602
  • Low Power Consumption (typical values at 5 MHz)– Active Current: 9 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
  • Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 32 KWord)for SST39VF1602– Bottom Block-Protection (bottom 32 KWord)for SST39VF1601
  • Sector-Erase Capability– Uniform 2 KWord sectors
  • Block-Erase Capability– Uniform 32 KWord blocks
  • Chip-Erase Capability
  • Erase-Suspend/Erase-Resume Capabilities
  • Hardware Reset Pin (RST#)
  • Security-ID Feature– SST: 128 bits; User: 128 bits
  • Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
  • Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)
  • All non-Pb (lead-free) devices are RoHS compliant
View More
Overview
Documents
Development Environment
Similar Devices
RoHS Information
Add To Cart

Device Overview

Summary

*Not Recommended for New Design*
The SST39VF1602 device is 1M x16, CMOS Multi-Purpose Flash Plus (MPF+) manufactured with our proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF1602 writes (Program or Erase) with a 2.7-3.6V power supply. This device conforms to JEDEC standard pinouts for x16 memories.

Please consider this device SST39VF1602C

Additional Features
    • Organized as 1M x16: SST39VF1601/1602
    • Low Power Consumption (typical values at 5 MHz)– Active Current: 9 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
    • Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 32 KWord)for SST39VF1602– Bottom Block-Protection (bottom 32 KWord)for SST39VF1601
    • Sector-Erase Capability– Uniform 2 KWord sectors
    • Block-Erase Capability– Uniform 32 KWord blocks
    • Chip-Erase Capability
    • Erase-Suspend/Erase-Resume Capabilities
    • Hardware Reset Pin (RST#)
    • Security-ID Feature– SST: 128 bits; User: 128 bits
    • Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
    • Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)
    • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
16 Mbit
Op. Volt Range (V)
2.7 to 3.6
Read Access Time
70 ns
Temp Range (°C)
-40°C to +85°C
Endurance
100,000

Documents

Jump to:

Board Design Files

MISC

  
33KB

Development tools data is currently unavailable.

Similar Devices

Product
Memory Size
Memory Speed
Package
Price 5K
16000K
0 MHz
TFBGA-48, TSOP-48
$1.92
16000K
0 MHz
TFBGA-48, TSOP-48, WFBGA-48
$1.01
16000K
0 MHz
TFBGA-48, TSOP-48
$1.35
16000K
0 MHz
TFBGA-48, TSOP-48, WFBGA-48
$1.01
16000K
0 MHz
TFBGA-48, TSOP-48
$1.48
16000K
0 MHz
TFBGA-48, TSOP-48
$1.48
16000K
0 MHz
TFBGA-48, WFBGA-48
$1.40
16000K
0 MHz
TFBGA-48, WFBGA-48
$1.57

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST39VF1602-70-4C-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602-70-4C-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602C-70-4C-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602C-70-4C-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602C-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602C-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF1602C-70-4C-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF1602C-70-4I-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF1602-70-4C-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602-70-4C-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602-70-4I-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602-70-4I-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602C-70-4C-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602C-70-4C-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602C-70-4I-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602C-70-4I-EKE-MCK
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF1602C-70-4I-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from Microchip

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy