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SST12LP08

Status: Not Recommended for new designs

Features:

  • High Gain: – Typically 30 dB gain across 2.4~2.5 GHz over temperature 0°C to +85°C
  • High linear output power: – >28 dBm P1dB – Meets 802.11g OFDM ACPR requirement up to 23.5 dBm – ~3% added EVM up to 20 dBm for 54 Mbps 802.11g signal – Meets 802.11b ACPR requirement up to 23.5 dBm
  • High power-added efficiency/Low operating current for both 802.11g/b applications – ~34%/200 mA@POUT = 23.5 dBm for 802.11b/g Applications:
  • WLAN (IEEE 802.11b/g/n)
  • Home RF
  • Cordless phones
  • 2.4 GHz ISM wireless
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST12LP08 is a versatile power amplifier based on the highly-reliable InGaP/GaAs HBT technology. Easily configured for high-power applications with good power-added efficiency while operating over the 2.4- 2.5 GHz frequency band, it typically provides 30 dB gain with 34% power-added efficiency . The SST12LP08 has excellent linearity while meeting 802.11g spectrum mask at 23.5 dBm. The SST12LP08 also features easy board-level usage along with high-speed power-up/down control through a single combined reference voltage pin and is offered in both 12-contact XQFN and 6-contact XSON packages.

Additional Features
  • High Gain:– Typically 30 dB gain across 2.4~2.5 GHz over temperature0°C to +85°C
  • High linear output power:– >28 dBm P1dB– Meets 802.11g OFDM ACPR requirement up to 23.5 dBm– ~3% added EVM up to 20 dBm for 54 Mbps 802.11g signal– Meets 802.11b ACPR requirement up to 23.5 dBm
  • High power-added efficiency/Low operating current for both 802.11g/b applications– ~34%/200 mA@POUT = 23.5 dBm for 802.11b/gApplications:
  • WLAN (IEEE 802.11b/g/n)
  • Home RF
  • Cordless phones
  • 2.4 GHz ISM wireless
Parametrics
Name
Value
Type
Power Ampllifier
Gain
30
Linear Power
20
Voltage min
2.75
Voltage max
4.2
Freq min
2.4
Freq max
2.4
Technology
InGaP/GaAs HBT
Application
802.11b/g/n

Documents

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST12LP08-QX6E
0.006100
0.027667
6
XSON
1.5x1.5x0.45mm
Matte Tin
e3
SST12LP08-QXBE
0.010100
0.031000
12
XQFN
2x2x0.45mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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