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PIC33FJ09GS302

Status: In Production

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RoHS Information
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
DSPIC33FJ09GS302-I/TL
0.147500
0.109589
36
VTLA
5x5x0.9mm
NiPdAu
e4
DSPIC33FJ09GS302T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302T-E/MMVAO
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302-E/MMVAO
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ09GS302-E/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
DSPIC33FJ09GS302T-E/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
DSPIC33FJ09GS302-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ09GS302-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ09GS302-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ09GS302-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ09GS302-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
DSPIC33FJ09GS302-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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