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MCP2562

High-speed CAN Transceiver with Standby Mode and VIO Pin

Status: In Production

Features:

  • Supports 1 Mb/s operation
  • Implements ISO-11898-5 standard physical layerrequirements
  • AEC-Q100 Grade 0
  • Very low standby current (Typ: 5µA)
  • VIO supply pin (MCP2562) to interface directly to CAN controllers and microcontrollers with 1.8V to 5V I/O
  • SPLIT output pin (MCP2561) to stabilize common mode in biased split termination schemes
  • CAN bus pins are disconnected when device is unpowered. An unpowered node or brown-out event will not load the CAN bus
  • Detection of ground fault; Permanent dominant detection on TXD, Permanent dominant detection on bus
  • Power-on Reset and voltage brown-out protectionon VDD and VIO pin
  • Protection against damage due to short-circuitconditions (positive or negative battery voltage)
  • Protection against high-voltage transients in automotive environments
  • Automatic Thermal Shutdown protection
  • Suitable for 12V and 24V systems
  • Up to 112 nodes can be connected
  • High-noise immunity due to differential bus implementation
  • High ESD protection on CANH and CANL, IEC61000-4-2 > 8kV
  • Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L.
  • Temperature ranges; Extended (E): -40°C to +125°C, High (H): -40°C to +150°C
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP2561/2 is Microchip Technology Inc. second generation high-speed CAN transceiver. It serves as an interface between a CAN protocol controller and the physical two-wire CAN bus. The device meets the automotive requirements for high-speed (1 Mb/s), low quiescent current, electromagnetic compatibility (EMC) and electrostatic discharge (ESD). The device family members are: • MCP2561 with SPLIT pin • MCP2562 with VIO pin

Additional Features
    • Supports 1 Mb/s operation
    • Implements ISO-11898-5 standard physical layerrequirements
    • AEC-Q100 Grade 0
    • Very low standby current (Typ: 5µA)
    • VIO supply pin (MCP2562) to interface directly to CAN controllers and microcontrollers with 1.8V to 5V I/O
    • SPLIT output pin (MCP2561) to stabilize common mode in biased split termination schemes
    • CAN bus pins are disconnected when device is unpowered. An unpowered node or brown-out event will not load the CAN bus
    • Detection of ground fault; Permanent dominant detection on TXD, Permanent dominant detection on bus
    • Power-on Reset and voltage brown-out protectionon VDD and VIO pin
    • Protection against damage due to short-circuitconditions (positive or negative battery voltage)
    • Protection against high-voltage transients in automotive environments
    • Automatic Thermal Shutdown protection
    • Suitable for 12V and 24V systems
    • Up to 112 nodes can be connected
    • High-noise immunity due to differential bus implementation
    • High ESD protection on CANH and CANL, IEC61000-4-2 > 8kV
    • Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L.
    • Temperature ranges; Extended (E): -40°C to +125°C, High (H): -40°C to +150°C
Parametrics
Name
Value
Temp. Range (°C)
-40 to +150
Operating Voltage Range (V)
4.5 to 5.5

Documents

Jump to:

Data Sheet

07/14/2014
781KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2562-H/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2562-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2562FD-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2562FD-H/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2562-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562FDT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562FD-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562FDT-H/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562FD-H/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562-H/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562T-H/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2562-E/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562T-E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562-E/MFVAO
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562T-E/MFVAO
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562FD-E/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562FDT-E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562FD-H/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562FDT-H/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562-H/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2562T-H/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP25625-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
MCP25625T-E/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
MCP25625-E/MLVAO
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
MCP25625T-E/MLVAO
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
MCP25625-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
MCP25625T-E/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
MCP25625-E/SSVAO
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
MCP25625T-E/SSVAO
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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