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IS2025

Status: In Production

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Device Overview

Summary

The IS2025 stereo audio chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth 5.0 applications.  This chip is fully compliant with Bluetooth specifications and is completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.  It incorporates Bluetooth 1M/2M/3Mbps RF, single-cycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and Microchip’s own Bluetooth software stack to achieve the required BT 5.0 with EDR functions.

For delivering superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.  For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced audio applications, SBC/AAC_LC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements.

In addition, to minimize the external components required for portable devices, a battery voltage sensor, battery charger, a switching regulator and LDO are integrated to reduce system BOM cost for various Bluetooth applications.  As the market of portable/wireless speakers demand is increasing, a stereo 2 channels 2.3W class-D amplifier which provides up to 100dB SNR is also built-in to reduce BOM cost and PCB area.

Additional Features
  • Bluetooth 5 certified
  • HFP 1.6
  • HSP 1.1
  • A2DP 1.2
  • AVRCP 1.5
  • SPP 1.0
  • PBAP 1.0
  • 16MHz main clock input
  • Built-in internal ROM for program memory
  • Support to connect to two hosts ( phones, tablets…) with HFP or A2DP profiles simultaneously
  • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
  • Fast Connection supported
  • Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches
  • Max. +4dBm output power with 20 dB level control from register control
  • Built-in T/R switch for Class 2/3 application
  • To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control
  • Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter
  • Crystal oscillation with built-in digital trimming for temperature/process variations
  • Noise suppression
  • Echo suppression
  • SBC and optional AAC decoding
  • Packet loss concealment
  • Built-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one
  • 20 bit DAC and 16 bit ADC codec
  • 98dB SNR DAC playback
  • Built-in 2 channel 2.3W class-D amplifier for a 4Ω speaker
  • Built-in Lithium-ion battery charger (up to 350mA)
  • Integrate 3V, 1.8V configurable switching regulator and LDO
  • Built-in ADC for battery monitor and voltage sense.
  • A line-in port for external audio input
  • Two LED drivers
  • High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps)
  • 8 x 8 mm2 68QFN package
Parametrics
Name
Value
Bluetooth Classic-Data/SPP
Yes
Bluetooth Classic-Audio
Yes
Audio Channels
Stereo
Analog Audio Out
Yes
MIC-in
2
Line-in
Yes
I2C
1
TX Power
+4dBm
GPIO
10
Pin Count
68
Package Type
QFN
Package Size
8 x 8 mm
Temperature Range
-20C to 70C
Operating Voltage Range
3.0 to 4.25

Documents

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Data Sheets

07/20/2015
2730KB

Supporting Collateral


Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
IS2025S-203
0.334000
68
VQFN
8x8x0.9mm
Matte Tin
e3
IS2025S-203-TRAY
0.865385
68
VQFN
8x8x0.9mm
Matte Tin
e3
IS2025S-002
0.334000
68
VQFN
8x8x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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