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AN17.19

Title:
USB332x Transceiver Layout Guidelines
Name:
AN17.19
Date:
02/28/2019
Description:
Microchip’s USB332x comes in a 25 ball Wafer-Level Chip-Scale Package (WLCSP) lead-free RoHS compliant package;(1.95 mm X 1.95 mm, 0.4mm pitch package. This application note provides general PCB layout guidelines for the USB332x family of devices. The Universal Serial Bus (USB) is capable of operating at 480 Mbps. Excellent signal integrity is required to operate reliably at high-speed data rates. The PCB layout is a critical component in maintaining signal integrity.
Keywords:
USB332x
 
Application Notes & Source Code
 Last Updated
Size
 
  AN17.19
  03/01/2019
  101KB
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