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AN2087

Download Application Note
Title
Title
Package Application Note for Fine Pitch Ball Grid Array (FBGA)
Name
Name
AN2087
Date
Date
01/29/2016
Description
Description
This package application note provides guidelines for the handling and assembly of Microchip fine pitch BGA packages during Printed Circuit Board (PCB) assembly. In addition, it provides general information for the PCB land pattern design and component rework guidelines.