Meet the HV-D3 Package mSiC Modules, a high-voltage, medium-power module platform built for demanding industrial, energy, and transportation environments. In this quick video, we break down five key reasons engineers choose HV-D3 mSiC modules for efficient, reliable, and scalable power designs: 1️⃣ Standardized D3 Platform – Shares key dimensions with the widely used 62mm package to simplify mechanical integration, while optimizing internal structure (15nH vs 20nH) to reduce voltage overshoot and improve EMI performance. 2️⃣ Advanced mSiC® MOSFET Technology – Delivers low switching and conduction losses, strong short-circuit capability, and thermal stability, with select variants integrating Schottky barrier diodes for improved reverse recovery. 3️⃣ High-Isolation Application Support – Features 6kV isolation to simplify manufacturing and eliminate the need for paralleling discrete devices, making it perfect for Solid State Transformers (SSTs) in AI datacenters, Megawatt Charging stations, and pulse power applications. 4️⃣ Multiple Advanced Power Topologies – Available in pre-defined high-power converter topologies (including phase-leg/half-bridge and common source) to enable faster system development. 5️⃣ Industrial-Grade Scalability & Reliability – Designed with a robust baseplate for efficient cooling, exceptional temperature stability, and proven capability to pass rigorous HV-H3TRB testing for a long service life. 👉 Learn more and download the datasheet: microchip.com/HVD3