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WP3161W6NHEI-400B1

WP3SL

WinPath3 SuperLite Network Processors

Status: In Production

Features:

  • A sophisticated multi-core communication engine with a large internal program RAM for data path processing
  • General-purpose MIPS 34K processor provides on-board control path software processing
  • 6 Gigabit Ethernet, 24 Fast Ethernet, 16 TDM
  • The Hardware Shaper implements 3-level shaping over up to 4K queues
  • The IPSec accelerator supports up to 1 Gbps data encryption and authentication
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

Microchip's WinPath3-SuperLite (WP3-SL) provides a powerful, yet lower cost WinPath3 solution for access processing in the access infrastructure and CPE (customer premises equipment) market. This new family of devices leverages Microchip's broad portfolio of hardened market-ready protocols and industry preferred I/O interfaces and provides this solution in devices priced less than previous WinPath devices. It has the same processing elements as the WinPath3, but a reduced number (six) running up to 400 MHz. These processing elements support the latest packet based protocols such as Ethernet, PWE3 (for Ethernet TDM, HDLC, ATM), and Packet Network Synchronization (IEEE1588v2, Synchronous Ethernet, adaptive and differential clock recovery). It also supports ML-PPP, IMA, CES, OAM (for Ethernet and ATM), QoS (policing, shaping, per-flow queuing, WRED), plus many other protocols. The WP3-SL incorporates the new WinPath3 hardware accelerators such as a flexible high performance classifier, a hierarchical shaper, an integrated security engine and more. The WP3-SL family broadens the Microchip solution to include a high performance yet lower cost option providing WinPath users a program of minimum design risk and short time to market.

Additional Features
  • A sophisticated multi-core communication engine with a large internal program RAM for data path processing
  • General-purpose MIPS 34K processor provides on-board control path software processing
  • 6 Gigabit Ethernet, 24 Fast Ethernet, 16 TDM
  • The Hardware Shaper implements 3-level shaping over up to 4K queues
  • The IPSec accelerator supports up to 1 Gbps data encryption and authentication
  • The Policing Accelerator supports single and dual leaky bucket policing
  • Growing list of available data path software supporting interworking, QoS, and Layer 2/3 protocols such as VPWS, VPLS, L3VPN
  • 27mm x 27mm FCBGA

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Supporting Collateral


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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
WP3160W6NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161D4NFEI-400B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161F5NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161W1EFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161W6NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161EFEI-400B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T160NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T161EFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T161NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T161NFEI-400B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3160W3NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T160NFEI-400B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
T161EFEI-400B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161R4NFEI-320B1
2.641100
0.000000
672
BGA
2x7x27x2.20mm
SAC305
e1
WP3161W6NHEI-400B1
0.000000
0.000000
672
B1BGA
2x7x27x2.80mm
SAC305
e1
T161NHEI-400B1
0.000000
0.000000
672
B1BGA
2x7x27x2.80mm
SAC305
e1
T061NHEI-250B1
0.000000
0.000000
528
HBFBGA
19x19x2.71mm
SAC305
e1
T061NHEI-320B1
0.000000
0.000000
528
HBFBGA
19x19x2.71mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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