Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

AN792

Title:
A Method to Determine How Much Power a SOT23 Can Dissipate in an Application
Name:
AN792
Date:
07/18/2001
Author:
Terry Cleveland
Description:
With the introduction of smaller surface mount (SMT) packages, it is becoming increasingly important to know their maximum power handling capability in specific applications. The power dissipation capability is directly proportional to size. As the size decreases, the amount of power that the package can dissipate decreases. Also, with the development of new high performance packages such as MSOPs, MLPs and SC70s, it is important to know how much power the package can reliably dissipate. Data sheets and package manufactures provide power handling data for packages using industry standard test setups. It is impossible to specify the capability for specific applications. The actual power handling capability can vary significantly depending on many application specific variables.
Keywords:
LDO,Thermal,Resistance,Power,Dissipation,Heat
 
Application Notes & Source Code
 Last Updated
Size
 
  AN792
  03/14/2004
  523KB
Silicon Products