| Title |
Title
USB332x Transceiver Layout Guidelines
|
|---|---|
| Name |
Name
AN1719
|
| Date |
Date
03/01/2019
|
| Description |
Description
Microchip’s USB332x comes in a 25 ball Wafer-Level Chip-Scale Package (WLCSP) lead-free RoHS compliant package;(1.95 mm X 1.95 mm, 0.4mm pitch package. This application note provides general PCB layout guidelines for the USB332x family of devices. The Universal Serial Bus (USB) is capable of operating at 480 Mbps. Excellent signal integrity is required to operate reliably at high-speed data rates. The PCB layout is a critical component in maintaining signal integrity.
|
| Description | Product |
Description |
|---|---|---|
|
USB3321
26Mhz USB 2.0 ULPI PHY IC in WLCS package
|
USB3321 | 26Mhz USB 2.0 ULPI PHY IC in WLCS package |
|
USB3320
Multi-frequency USB 2.0 ULPI PHY IC
|
USB3320 | Multi-frequency USB 2.0 ULPI PHY IC |
|
USB3327
27Mhz USB 2.0 ULPI PHY IC in WLCS package
|
USB3327 | 27Mhz USB 2.0 ULPI PHY IC in WLCS package |
|
USB3322
12Mhz USB 2.0 ULPI PHY IC in WLCS package
|
USB3322 | 12Mhz USB 2.0 ULPI PHY IC in WLCS package |
|
USB3329
13Mhz USB 2.0 ULPI PHY IC in WLCS package
|
USB3329 | 13Mhz USB 2.0 ULPI PHY IC in WLCS package |
|
USB3326
19.2Mhz USB 2.0 ULPI PHY IC in WLCS package
|
USB3326 | 19.2Mhz USB 2.0 ULPI PHY IC in WLCS package |
Live Chat