Microchip Technology Inc

MCP14E9

In Production

The MCP14E9/E10/E11 devices are a family of 3A,dual output buffers/MOSFET drivers with seperate enable functions for each output. As MOSFET drivers, the MCP14E9/E10/E11 can charge 1800 pF gate capacitance in under 25 nsec (max).The inputs are TTL/CMOS compatiple and provide 300 mV of hysteresis between the high and low input levels that allows it to be driven from slow rising and falling signals and provide noise immunity.

 

    Features

        • High peak output Current: 3A (typ)
        • Independent Enable Function for each Driver
        • Low Shoot-Through/Cross-Conduction Current in output Stage
        • Wide input supply Operating Range: 4.5v to 18V
        • High Capacitive Load drive Capability:
          • 1800 pF in 20 nsec (typ)
        • Short Delay Times: 40 nsec(typ)
        • Matched rise/fall Times
        • Low output Impedance: 2.2 Ohms (typ)
        • Latch-up Protected: Will withstand 1.5A Reverse Current
        • Input are TTL/CMOS compatiple and will withstand negativeswings Up To 5V
        • ESD Protected: 4kV
    Parameter Name
    Value
    MOSFET Driver Type
    Low Side
    Driver Type
    Dual
    Configuration
    Inverting
    Peak Output Current (source/sink, A)
    3.0/3.0
    Output Resistance (source/sink, Ω)
    4/4
    Maximum Supply Voltage (V)
    18
    Propagation Delay (Td1/Td2, ns)
    45/45
    Rise/Fall Time (Tr/Tf, ns)
    14/17
    Capacitive Load Drive
    1800 pF in 17 ns
    Features
    Enable pin
    Documentation
    Data Sheets
    03/30/2011
    783KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    MCP14E9-E/MF
    8
    DFN-S
    -40C to +125C
    TUBE
    1.84
    1.53
    1.39
    1.34
    1.32
    MCP14E9-E/P
    8
    PDIP
    -40C to +125C
    TUBE
    1.72
    1.43
    1.29
    1.25
    1.23
    MCP14E9-E/SN
    8
    SOIC
    -40C to +125C
    TUBE
    1.69
    1.40
    1.27
    1.22
    1.21
    MCP14E9T-E/MF
    8
    DFN-S
    -40C to +125C
    T/R
    1.84
    1.53
    1.39
    1.34
    1.32
    MCP14E9T-E/SN
    8
    SOIC
    -40C to +125C
    T/R
    1.69
    1.40
    1.27
    1.22
    1.21

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    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    MCP14E9-E/P
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    MCP14E9T-E/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    MCP14E9-E/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    MCP14E9-E/MF
    0.076900
    0.133333
    8
    DFN-S
    6x5x0.9mm
    Matte Tin
    e3
    MCP14E9T-E/MF
    0.076900
    0.218182
    8
    DFN-S
    6x5x0.9mm
    Matte Tin
    e3
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    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.