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PIC24HJ64GP502

Status: In Production

Features:

  • Up to 40 MIPS operation
  • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
  • Single-cycle MUL plus hardware divide
  • 10/12-bit ADC with 1.1Msps/500 Ksps conversion rate: - Up to 13 ADC input channels and four S&H
  • Flexible/Independent trigger sources
  • Enhanced CAN (ECAN) module (1 Mbaud) with 2.0B support
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Overview
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Development Environment
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RoHS Information
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Device Overview

Summary

The PIC24H 16-bit device family employs a powerful 16-bit architecture, ideal for applications that rely on high-speed, repetitive computations, as well as control. The devices are pin compatible with the dsPIC33F family of devices, and share a very high degree of compatibility with the dsPIC30F family devices. This allows seamless migration options from/to PIC24F, dsPIC30F and dsPIC33F devices.

Additional Features
  • Operating Conditions
    • Up to 40 MIPS operation
    • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
    • 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
  • High-Efficiency PIC24H core
    • Modified Harvard architecture
    • C compiler optimized instruction set
    • 16-bit wide data path, 24-bit wide instructions
    • Single-cycle MUL plus hardware divide
    • 16 x 16 multiply operations
    • 32/16 and 16/16 divide operations
    • Up to ±16-bit shifts for up to 40-bit data
  • Clock Management
    • 2% internal oscillator
    • Programmable PLL and oscillator clock sources
    • Fail-Safe Clock Monitor (FSCM)
    • Independent Watchdog Timer
    • Low-power management modes
    • Fast wake-up and start-up
  • Advanced Analog Features
    • 10/12-bit ADC with 1.1Msps/500 Ksps conversion rate: - Up to 13 ADC input channels and four S&H
    • Flexible/Independent trigger sources
    • 150 ns Comparators: - Up to two Analog Comparator modules
    • 4-bit DAC with two ranges for Analog Comparators
  • Input/Output
    • Software remappable pin functions
    • 5V-tolerant pins
    • Selectable open drain and internal pull-ups
    • Up to 5 mA overvoltage clamp current/pin
    • Multiple external interrupts
  • System Peripherals
    • Cyclic Redundancy Check (CRC) module
    • Up to five 16-bit and up to two 32-bit Timers/ Counters
    • Up to four Input Capture (IC) modules
    • Up to four Output Compare (OC) modules
    • Real-Time Clock and Calendar (RTCC) module
  • Communication Interfaces
    • Parallel Master Port (PMP)
    • Two UART modules (10 Mbps) - Supports LIN 2.0 protocols - RS-232, RS-485, and IrDA® support
    • Two 4-wire SPI modules (15 Mbps)
    • Enhanced CAN (ECAN) module (1 Mbaud) with 2.0B support
    • I2C module (100K, 400K and 1Mbaud) with SM Bus support
  • Direct Memory Access (DMA)
    • 8-channel hardware DMA with no CPU stalls or overhead
    • Most peripherals support DMA
  • Debugger Development Support
    • In-circuit and in-application programming
    • Two program breakpoints
    • Trace and run-time watch
Parametrics
Name
Value
Architecture
16-bit
Max CPU Speed (MHz)
80
CPU Speed (MIPS/DMIPS)
40
Program Memory Size (KB)
64
SRAM (KB)
8
Direct Memory Access Channels
8
Temperature Range (C)
-40 to 150
Operating Voltage Range (V)
3 to 3.6
Pin Count
28
Comparators
2
Analog Peripherals
1-A/D 10x12-bit @ 500(ksps) 1-D/A 0x4-bit
UART
2
SPI
2
I2C
1
Timers
5 x 16-bit 2 x 32-bit
Input Capture
4
Max PWM outputs (including complementary)
4
Number of PWM Time Bases
2
Output Compare Channels
4
Number of CAN Modules
1
Type of CAN Module
CAN
Class B Hardware
Yes
Peripheral Pin Select / Pin Muxing
Yes

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  • Socket: AC164336   PartNo: PIC24HJ64GP502 (28MM)
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC24HJ64GP502-H/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502T-H/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24HJ64GP502-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502-H/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502-I/SOVAO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502T-H/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502T-I/SOA21
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502-I/SOA21
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24HJ64GP502-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC24HJ64GP502-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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