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DN2625

250V, 3.5 Ohm, N-Channel, Depletion Mode, Vertical DMOS FET

Status: In Production

Features:

  • Very low gate threshold voltage
  • Designed to be source-driven
  • Low switching losses
  • Low effective output capacitance
  • Designed for inductive loads
  • Well matched for low second harmonic when driven by MD2130
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Overview
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Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

DN2625 is a low threshold depletion-mode (normally-on) transistor utilizing an advanced vertical DMOS structure and well-proven silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown. Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired. The DN2625DK6-G contains two MOSFETs in an 8-lead, dual pad DFN package. The DN2625K6-G in the 14-lead QFN package is not recommended for new designs, but may continue to be purchased for existing designs.

Additional Features
    • Very low gate threshold voltage
    • Designed to be source-driven
    • Low switching losses
    • Low effective output capacitance
    • Designed for inductive loads
    • Well matched for low second harmonic when driven by MD2130
Parametrics
Name
Value
BVdsx min (V)
250
RDS
3.5
Vgs(off) min (V)
-1.5
Vgs(off) max (V)
-2.1
Package
DFN-8, TO-252

Documents

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
DN2625K4-G
1.420000
0.501000
3
DPAK
-
Matte Tin
e3
DN2625DK6-G
0.044900
0.469388
8
VDFN
5x5x1.0mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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