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MCP48FEB12

Status: In Production

Features:

  • 10-bit Resolutions
  • Rail-to-Rail Output
  • Fast Settling Time: 7.8 µs (typ)
  • DAC Voltage Reference Options: Device VDD External VREF (buffered or unbuffered) Internal Bandgap (1.22V typ)
  • Device VDD
  • External VREF (buffered or unbuffered)
  • Internal Bandgap (1.22V typ)
  • Unity (1x)
  • 2x (when not using internal VDD as voltage source)
  • User programmed POR/BOR output setting recall and Device Configuration bits
  • Auto Recall of Saved DAC register setting
  • Auto Recall of Saved Device Configuration(Voltage Reference, Gain, Power Down)
  • Disconnects output buffer (High Impedance)
  • Selection of VOUT pull-down resistors (100 kΩ or 1 kΩ)
  • Normal Operation: 380µA (max)
  • Power Down Operation: 650nA (typ)
  • EEPROM write cycle: 1.9mA (max)
  • Single-Supply Operation: 2.7V to 5.5V
  • SPI Interface
  • 10-lead MSOP Package
  • Extended Temperature Range: -40°C to +125°C
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

MCP48FEB12 is a dual channel, 10-bit, voltage output Digital-to-Analog Converter with EEPROM and an SPI Compatible Serial Interface. This device provides four different voltage reference options: device VDD, external VREF (buffered or unbuffered) and internal bandgap. It offers high AC performance, low power consumption and fast settling time. The device has integrated EEPROM to save DAC settings at power down. It is suitable for consumer and industrial applications, such as set point control, offset adjustment and sensor calibration applications, and portable instrument. 

For different resolutions and number of output channels, please check out our other parts in the MCP48FEBxx family.


Additional Features
    • 10-bit Resolutions
    • Rail-to-Rail Output
    • Fast Settling Time: 7.8 µs (typ)
    • DAC Voltage Reference Options:
      • Device VDD
      • External VREF (buffered or unbuffered)
      • Internal Bandgap (1.22V typ)
    • Output Gain Options:
      • Unity (1x)
      • 2x (when not using internal VDD as voltage source)
    • Non-Volatile Memory (EEPROM)
      • User programmed POR/BOR output setting recall and Device Configuration bits
      • Auto Recall of Saved DAC register setting
      • Auto Recall of Saved Device Configuration(Voltage Reference, Gain, Power Down)
    • Power-Down modes:
      • Disconnects output buffer (High Impedance)
      • Selection of VOUT pull-down resistors (100 kΩ or 1 kΩ)
    • Low Power Consumption
      • Normal Operation: 380µA (max)
      • Power Down Operation: 650nA (typ)
      • EEPROM write cycle: 1.9mA (max)
    • Single-Supply Operation: 2.7V to 5.5V
    • SPI Interface
    • 10-lead MSOP Package
    • Extended Temperature Range: -40°C to +125°C
Parametrics
Name
Value
Typical Standby Current (µA)
0.65
Typical Operating Current (µA)
250
Resolution (Bits)
10
DACs per Package
2
Vref
Int,VDD,Ext
Output Settling Time (µs)
7.8
DNL (LSB)
±0.5
Temp. Range (°C)
-40°C to +125°C
Interface
SPI

Documents

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Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
MSOP-10 and MSOP-8 Bondout Board
MSOP-10 and MSOP-8 Bondout Board ( ADM00309 )

The MSOP-10 and MSOP-8 Evaluation Board is a bond-out board that allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following packages:
• MSOP (8- and 10-pin )
• DIP (10 pin)

Note:
• The Evaluation Board can be used as a MSOP- to DIP- converter
• The kit contains 10 blank...

Learn More
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP48FEB12-E/UN
0.023200
0.060000
10
MSOP
3x3mm
Matte Tin
e3
MCP48FEB12T-E/UN
0.023200
0.200000
10
MSOP
3x3mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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