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AN6408
| Title |
Title
Mounting Instructions for BZPACK Press-FIT Power Modules
|
|---|---|
| Name |
Name
AN6408
|
| Date |
Date
03/17/2026
|
| Description |
Description
This application note provides recommendations for properly connecting BZPACK Press-FIT power modules to the Printed Circuit Board (PCB) and mounting these baseplate-less power modules to the heat sink.
|
Silicon Products
| Description | Product |
Description |
|---|---|---|
|
MSCSMC120AM04TBZ2AEG-Module
1200V, 4 mOhm Phase Leg BZ2 mSiC® Power Module with AlN Substrate
|
MSCSMC120AM04TBZ2AEG-Module | 1200V, 4 mOhm Phase Leg BZ2 mSiC® Power Module with AlN Substrate |
|
MSCSMC120AM04TBZ2EG-Module
1200V, 4 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate
|
MSCSMC120AM04TBZ2EG-Module | 1200V, 4 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate |
|
MSCSMC120AM08TBZ2EG-Module
1200V, 8 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate
|
MSCSMC120AM08TBZ2EG-Module | 1200V, 8 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate |
|
MSCSMC120HM14TBZ2EG-Module
1200V, 14 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate
|
MSCSMC120HM14TBZ2EG-Module | 1200V, 14 mOhm Phase Leg BZ2 mSiC® Power Module with Al2O3 Substrate |
|
MSCSMC120AM08TBZ2AEG-Module
1200V, 8 mOhm Phase Leg BZ2 mSiC® Power Module with AlN Substrate
|
MSCSMC120AM08TBZ2AEG-Module | 1200V, 8 mOhm Phase Leg BZ2 mSiC® Power Module with AlN Substrate |