Product Roundup: March 2026
Microchip's Product Roundup features a selection of our latest products, reference designs and software solutions. Explore how these innovative technologies can elevate your next design project.
MIC45M235 Power Module Delivers up to 35A Performance to Industrial and Edge AI Applications
Microchip’s new MIC45M235 power module is highly integrated with a 16V buck converter that can deliver up to 35A in a compact 11mm x 17mm x 6.46 mm package. The MIC45M235 is designed to make it easier for engineers to power today’s industrial and Edge AI systems without sacrificing efficiency, cost or board space. By combining an off‑the‑shelf controller and power stage, along with built‑in diagnostic features, the MIC45M235 offers a cost‑effective alternative to discrete designs while improving reliability, signal integrity and data accuracy. This approach reflects Microchip’s strength in providing proven, system‑level solutions that pair seamlessly with its industrial and Edge AI computing platforms, enabling faster time‑to‑market and lower overall design risk for next‑generation industrial applications.
 |
HV‑D3 mSiC® Power Modules
The HV‑D3 mSiC® Power Modules extend the proven D3 module platform into higher‑voltage applications, supporting 3.3 kV operation in an industry‑standard 62 mm package. Designed for demanding high‑power systems, these modules combine advanced mSiC MOSFET technology with a robust, high‑reliability package optimized for thermal performance, electrical isolation and long‑term durability. Built on a Si₃N₄ substrate for low thermal resistance and enhanced reliability, HV‑D3 modules enable efficient high‑voltage power conversion while maintaining compatibility with widely adopted D3 footprints.
 |
Resources
High-res images available through Flickr (feel free to publish): https://flic.kr/s/aHBqjCPsAz