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SST25VF020A

Status: End of Life

Features:

  • Single 2.7-3.6V Read and Write Operations
  • Serial Interface Architecture– SPI Compatible: Mode 0 and Mode 3
  • 33 MHz Max Clock Frequency
  • Superior Reliability– Endurance: 100,000 Cycles (typical)– Greater than 100 years Data Retention
  • Low Power Consumption:– Active Read Current: 7 mA (typical)– Standby Current: 8 µA (typical)
  • Flexible Erase Capability– Uniform 4 KByte sectors– Uniform 32 KByte overlay blocks
  • Fast Erase and Byte-Program:– Chip-Erase Time: 70 ms (typical)– Sector- or Block-Erase Time: 18 ms (typical)– Byte-Program Time: 14 µs (typical)
  • Auto Address Increment (AAI) Programming– Decrease total chip programming time overByte-Program operations
  • End-of-Write Detection– Software Status
  • Hold Pin (HOLD#)– Suspends a serial sequence to the memorywithout deselecting the device
  • Write Protection (WP#)– Enables/Disables the Lock-Down function of thestatus register
  • Software Write Protection– Write protection through Block-Protection bits instatus register
  • Temperature Range– Commercial: 0°C to +70°C– Extended: -20°C to +85°C
  • Packages Available– 8-bump XFBGA
  • All non-Pb (lead-free) devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

SST's serial flash family features a four-wire, SPI-compatible interface that allows for a low pin-count package occupying less board space and ultimately lowering total system costs. SST25VF020A SPI serial flash memory is manufactured with SST proprietary, high performance CMOS SuperFlash Technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.

Please consider this device SST25VF020B

Additional Features
    • Single 2.7-3.6V Read and Write Operations
    • Serial Interface Architecture– SPI Compatible: Mode 0 and Mode 3
    • 33 MHz Max Clock Frequency
    • Superior Reliability– Endurance: 100,000 Cycles (typical)– Greater than 100 years Data Retention
    • Low Power Consumption:– Active Read Current: 7 mA (typical)– Standby Current: 8 µA (typical)
    • Flexible Erase Capability– Uniform 4 KByte sectors– Uniform 32 KByte overlay blocks
    • Fast Erase and Byte-Program:– Chip-Erase Time: 70 ms (typical)– Sector- or Block-Erase Time: 18 ms (typical)– Byte-Program Time: 14 µs (typical)
    • Auto Address Increment (AAI) Programming– Decrease total chip programming time overByte-Program operations
    • End-of-Write Detection– Software Status
    • Hold Pin (HOLD#)– Suspends a serial sequence to the memorywithout deselecting the device
    • Write Protection (WP#)– Enables/Disables the Lock-Down function of thestatus register
    • Software Write Protection– Write protection through Block-Protection bits instatus register
    • Temperature Range– Commercial: 0°C to +70°C– Extended: -20°C to +85°C
    • Packages Available– 8-bump XFBGA
    • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
2 Mbit
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
33 MHz
Temp Range (°C)
-25°C to +85°C
Endurance
100,000

Documents

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Development Environment

  • Code Examples

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST25VF020A-25-4E-ZAE
0.005000
0.088333
8
CSP
Varies
SAC
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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