SP6 mSiC^® Power Modules

Utilizes advanced mSiC MOSFET technology for low switching and conduction losses, enabling higher system efficiency and reduced heat generation

Supports operation up to 1700V and high, continuous/pulsed current capability for demanding traction, renewable energy and industrial applications

Package design offers high dielectric strength and creepage distances for safety in high-voltage environments

Silicon nitride (Si₃N₄) or Aluminum Nitride (AlN) substrate options andd optimized case materials provide low thermal resistance and high reliability under harsh conditions

Multiple internal topologies, such as phase leg and dual common source, allow use in inverters, converters and multilevel architectures

• Compact, single‑switch/diode module configurations for simple power conversion stages
• Well-suited for traction drives and industrial motor control
• Low‑inductance SP6C package supports fast switching and low EMI performance 
• Isolated, baseplate‑less construction enables direct heatsink mounting 
• Optimized thermal path supports high-power density and high‑temperature operation 
• Three power terminals: DC+, DC– and output node

• Balanced, low‑inductance package supports fast SiC switching, reduced EMI and high-current capability
• Thermally robust, rugged design delivers reliable operation in harsh environments
• Isolated, baseplate‑less construction enables direct heatsink mounting and compact layouts
• Integrated Negative Temperature Coefficient (NTC) thermistor provides accurate, reliable thermal monitoring
• Triple phase‑leg and multilevel support enables high‑power traction and grid inverter architectures

• Ultra‑low‑inductance SP6LI layout (~3 nH) enables very fast SiC switching with minimal overshoot and EMI
• High‑power‑density, low‑profile design supports higher switching frequencies and smaller passive components
• Isolated, baseplate‑less construction allows direct heatsink mounting with excellent thermal performance
• Integrated NTC thermistor provides accurate, real‑time thermal monitoring
• Optimized for high‑current phase‑leg and multilevel topologies

• Low‑inductance SP6C package enables fast switching and low EMI performance
• Isolated, baseplate‑less construction allows direct heatsink mounting and compact designs
• Integrated NTC thermistor supports accurate thermal monitoring 
• Full‑bridge topology integration simplifies inverter, rectifier and DC‑DC converter designs
• Power terminals for DC+, DC– and two-bridge output nodes

• Low‑inductance SP6C package enables fast SiC switching and reduced EMI
• Isolated, baseplate‑less design supports direct heatsink mounting and compact integration
• Integrated NTC thermistor enables accurate, reliable temperature monitoring
• Supports three‑level topologies: Neutral Point Clamped (NPC), T‑Type and Active NPC
• Power terminals for DC+, DC–, phase output, DC‑link midpoint and Kelvin source

• Low‑inductance SP6C package enables fast SiC switching and reduced EMI
• Isolated, baseplate‑less construction supports direct heatsink mounting
• Integrated NTC thermistor enables reliable thermal monitoring
• Half‑bridge Configuration (HC) optimized for high‑current power stages
• Power terminals for DC+, DC–, switching node and Kelvin source

An ANPC topology uses clamping devices to maintain the neutral point voltage in multilevel converters. This design reduces switching losses and improves efficiency in high-voltage applications such as renewable energy inverters and traction systems.

The full-bridge topology consists of four switches arranged to provide bidirectional current flow and full control of AC output. It is widely used in DC-AC inverters, motor drives and high-power conversion systems where flexibility and efficiency are critical.

By integrating multiple switches and diodes into a single package with standardized terminals, these modules reduce board area, simplifies assembly and enhances reliability compared to discrete device implementations.

A phase leg topology combines two switches in a half-bridge arrangement for inverter stages. It supports bidirectional current flow and efficient switching, commonly used in traction drives, industrial motor control and renewable energy systems.

The T-Type topology is a three-level converter design that uses an additional switch to reduce conduction losses and improve efficiency. It is often applied in medium-voltage drives and renewable energy systems where lower harmonic distortion is desired.

This topology divides the DC bus into three voltage levels, reducing voltage stress on devices and improving output waveform quality. It is suitable for high-power applications such as grid-tied inverters and large motor drives.

A triple-phase-leg module integrates three half-bridge legs in one package, enabling compact, three-phase inverter designs. It simplifies assembly and reduces system footprint for traction and industrial applications.

The Vienna rectifier is a three-level unidirectional topology that delivers high efficiency and low harmonic distortion for front-end power conversion in renewable energy systems and EV charging. The triple Vienna rectifier integrates three rectifier stages to offer higher power and three-phase input, enabling compact designs with superior performance in ultra-fast EV chargers and large industrial systems.