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SY89833L

Status: In Production

Features:

  • DC-to >2GHz throughput
  • <600ps propagation delay (IN-to-Q)
  • <20ps within-device skew
  • <190ps rise/fall times
  • 98fsRMS phase jitter
  • Unique input termination and VTpin accepts DC and AC-coupled inputs
  • High-speed LVDS outputs
  • 3.3V power supply operation
  • Industrial temperature range: -40°C to +85°C
  • Available in 16-pin (3mm x 3mm) QFN package
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The SY89833L is a 3.3V, high-speed 2GHz differential Low Voltage Differential Swing (LVDS) 1:4 fanout buffer optimized for ultra-low skew applications. Within device skew is guaranteed to be less than 20ps over supply voltage and temperature.The differential input buffer has a unique internal termination design that allows access to the termination network through a VT pin. This feature allows the device to easily interface to different logic standards. A VREF-AC reference is included for AC-coupled applications.The SY89833L is part of Micrel's high-speed clock synchronization family. For 2.5V applications, the SY89832U provides similar functionality while operating from a 2.5V ±5% supply. For applications that require a different I/O combination, choose from a comprehensive product line of highspeed, low-skew fanout buffers, translators and clock generators.

Additional Features
    • Guaranteed AC performance over temperature and voltage:
      • DC-to >2GHz throughput
      • <600ps propagation delay (IN-to-Q)
      • <20ps within-device skew
      • <190ps rise/fall times
    • Ultra-low jitter design
      • 98fsRMS phase jitter
    • Unique input termination and VTpin accepts DC and AC-coupled inputs
    • High-speed LVDS outputs
    • 3.3V power supply operation
    • Industrial temperature range: -40°C to +85°C
    • Available in 16-pin (3mm x 3mm) QFN package
Parametrics
Name
Value
Product Type
Fanout & Buffer and Drivers
Description
1:4
Input
ANY
Output
LVDS
Supply Voltage
3.3
Max Freq (GHz)
2
Max Prop Delay (ps)
600
Icc (mA)
75
Max Within Device Skew (ps)
20
OE
False
RPE
False
FSI
False
Input Mux
False
Input EQ
False
Output Type
LVDS

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SY89833LMG
0.021300
0.050000
16
VQFN
3x3x1.00mm
NiPdAu
e4
SY89833LMG-TR
0.021300
0.801700
16
VQFN
3x3x1.00mm
NiPdAu
e4
SY89833LMG-TX
0.021300
0.000000
16
VQFN
3x3x1.00mm
NiPdAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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