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SY84782U

Status: In Production

Features:

  • 2.5V power supply option
  • Ultra low power consumption (63mW typ)
  • Multirate up to 1.25Gbps
  • Fast rise and fall time
  • Modulation current up to 90mA
  • Laser may be DC or AC coupled
  • Guaranteed operation over –40°C to +85°C temperature range
  • Small form factor 16-pin (3mm x 3mm) QFN package
  • MIC3003G Compatible
  • Extensive temperature range (-40°C to +95°C)
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The SY84782U is a single 2.5V supply, ultra-low power, small form factor laser diode driver for telecom/datacom applications. Intended to drive FP/DFB lasers at data rates up to 1.25Gbps, it is especially useful for Compact SFP, SFP and SFF modules where power requirements are quite stringent. The driver can deliver modulation current up to 90mA and offers a high compliance voltage, all of which make the SY84782U suitable for high current operations in both AC and DC coupled applications.

The SY84782U is intended to be used with Micrel’s MIC3003 Optical Transceiver Management IC, which allows for both modulation and bias current control and monitoring. Furthermore, the MIC3003 offers power control and temperature compensation.

This device operates across the industrial temperature range (–40°C to +95°C) and is available in a small 3mm x 3mm QFN package.

Additional Features
  • 2.5V power supply option
  • Ultra low power consumption (63mW typ)
  • Multirate up to 1.25Gbps
  • Fast rise and fall time
  • Modulation current up to 90mA
  • Laser may be DC or AC coupled
  • Guaranteed operation over –40°C to +85°C temperature range
  • Small form factor 16-pin (3mm x 3mm) QFN package
  • MIC3003G Compatible
  • Extensive temperature range (-40°C to +95°C)
Parametrics
Name
Value
Part Type
Lasers and EML Drivers - DFB/FP Laser Drivers
Data Rate Capability
1.25
Power Supply (V)
2.5
Data Input Type
CML
Drive Current (mA)
90

Documents

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Data Sheet

11/11/2015
426KB

User Guides


Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SY84782UMG
0.021300
0.050000
16
VQFN
3x3x0.9mm
NiPdAu
e4
SY84782UMG-TR
0.021300
0.801700
16
VQFN
3x3x0.9mm
NiPdAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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