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SY75576L

Status: In Production

Features:

  • Four Differential Pairs of LVDS or HCSL Outputs
  • Two Pairs of Differential Inputs Accept LVDS or HCSL Logic Levels
  • 267MHz max HCSL Frequency
  • 100MHz max LVDS Frequency
  • 137fsRMS, 200MHz (12kHz-20MHz)
  • 153fsRMS, 156.25MHz (12kHz-20MHz)
  • 212fsRMS, 100MHz (12kHz-20MHz)
  • <2ps Total_Jitterpk-pk, 200MHz (BER = 10-12)
  • 50ps Output-to-Output Skew
  • 3.3V ±5% Power Supply Operation
  • -40ºC to +85ºC Operating Temperature
  • Available in 20-pin-TSSOP Lead-Free Package
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The SY75576L is a high-speed, fully differential 1:4 clock fanout buffer optimized to provide four identical output copies with 137fs phase jitter and maximum 50ps output-to-output skew. Designed to be used with PCI-Express applications, the SY75576L accepts and outputs HCSL or LVDS logic levels.

The SY75576L operates from a 3.3V ±5% power supply and is guaranteed over the full industrial temperature range (-40ºC to +85ºC). It is available in a 20-pin TSSOP lead-free package.

Additional Features
    • Four Differential Pairs of LVDS or HCSL Outputs
    • Two Pairs of Differential Inputs Accept LVDS or HCSL Logic Levels
    • 267MHz max HCSL Frequency
    • 100MHz max LVDS Frequency
    • Ultra Low Phase Jitter:
      • 137fsRMS, 200MHz (12kHz-20MHz)
      • 153fsRMS, 156.25MHz (12kHz-20MHz)
      • 212fsRMS, 100MHz (12kHz-20MHz)
    • <2ps Total_Jitterpk-pk, 200MHz (BER = 10-12)
    • 50ps Output-to-Output Skew
    • 3.3V ±5% Power Supply Operation
    • -40ºC to +85ºC Operating Temperature
    • Available in 20-pin-TSSOP Lead-Free Package

Parametrics
Name
Value
Product Type
Fanout & Buffer and Drivers
Description
PCIe Fanout Buffer, 267MHz, 4 HCSL/LVDS Outputs with 2 Input Mux
Input
HCSL/LVDS
Output
HCSL/LVDS
Supply Voltage
3.3
Max Freq (GHz)
0.267
Icc (mA)
75
Max Within Device Skew (ps)
50
OE
True
RPE
False
FSI
False
Input Mux
True
Input EQ
False
Voltage (V)
3.3
Output Type
HCSL/LVDS
Number Of Outputs
4

Documents

Jump to:

Data Sheet

05/03/2016
657KB

Silicon Product

10/30/2015
0B

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SY75576LKY
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
SY75576LKY-TR
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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