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SST39VF512

Status: End of Life

Features:

  • Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
  • Low Power Consumption – Active Current: 5 mA (typical) – Standby Current: 1 µA (typical)
  • Sector-Erase Capability – Uniform 4 KByte sectors
  • Fast Erase and Byte-Program: – Sector-Erase Time: 18 ms (typical) – Chip-Erase Time: 70 ms (typical) – Byte-Program Time: 14 µs (typical) – Chip Rewrite Time: 1 second (typical) for SST39LF/VF512
  • Packages Available – 32-lead PLCC – 32-lead TSOP (8mm x 14mm) – 48-ball TFBGA (6mm x 8mm) All non-Pb(lead-free) devices are RoHS compliant
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Overview
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Development Environment
RoHS Information
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Device Overview

Summary

The SST39VF512 is a 64K x8CMOS Multi-Purpose Flash (MPF) manufactured with proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF512 device writes (Program or Erase) with a 2.7-3.6V power supply. The device conforms to JEDEC standard pinouts for x8 memories.

Additional Features
  • Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
  • Low Power Consumption– Active Current: 5 mA (typical)– Standby Current: 1 µA (typical)
  • Sector-Erase Capability– Uniform 4 KByte sectors
  • Fast Erase and Byte-Program:– Sector-Erase Time: 18 ms (typical)– Chip-Erase Time: 70 ms (typical)– Byte-Program Time: 14 µs (typical)– Chip Rewrite Time:1 second (typical) for SST39LF/VF512
  • Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 48-ball TFBGA (6mm x 8mm)All non-Pb(lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
512 Kbit
Op. Volt Range (V)
2.7 to 3.6
Read Access Time
70 ns
Endurance
100,000

Documents

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Board Design Files

MISC

  
29KB

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