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PIC32MX274F256B

Status: In Production

Features:

  • Up to 72 MHz/116 DMIPS, MIPS32® M4K® core
  • eXtreme Low Power (XLP) Sleep and Deep Sleep 
  • USB 2.0-compliant Full-speed OTG controller
  • Two I2S/SPI modules for Codec and serial communications
  • Peripheral Pin Select (PPS) functionality
  • Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces
  • mTouch™ Capacitive touch
  • Temperature Range - 40°C to 105°C
  • Operating voltage range of 2.3V to 3.6V
  • 256KB Flash memory (plus an additional 12 KB of Boot Flash)
  • 64KB SRAM memory
  • MIPS16e® mode for up to 40% smaller code size
  • Low-power management modes (Sleep and Idle) Peripheral Features
  • Peripheral Pin Select (PPS) functionality to allow function remap
  • Two additional DMA channels dedicated to USB
  • Two  UARTs (12.5 Mbps) and two I2C™ modules
  • Hardware Real-Time Clock and Calendar (RTCC)
  • Five 16-bit and up to two 32-bit Timers/Counters
  • Five Capture inputs and Five Compare/PWM outputs Audio/Graphics/Touch HMI Features
  • External graphics interface
  • Audio data communication: I2S, LJ, RJ, USB
  • Audio data control interface: SPI and I2C™
  • Generation of fractional clock frequencies
  • Can be synchronized with USB clock
  • Can be tuned in run-time
  • Supports mTouch™ capacitive touch sensing Advanced Analog Features
  • 10-bit 1Msps rate with one Sample and Hold (S&H)
  • 9 analog inputs
  • Can operate during sleep mode
  • Flexible and independent ADC trigger sources
  • Three dual-input Comparator modules
  • In-circuit and in-application programming
  • 4-wire MIPS® Enhanced JTAG interface
  • Unlimited program and six complex data breakpoints
  • IEEE 1149.2-compatible (JTAG) boundary scan
  • MPLAB X Integrated Development Environment (IDE)
  • MPLAB Harmony Integrated Software Framework
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Overview
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Development Environment
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Device Overview

Summary

The PIC32MX27x family brings lower power run, sleep and deep sleep currents to the PIC32MX family, while increasing the frequency of 28 and 44 pin devices up to 72Mhz.  These devices are available in 128K and 256K Flash variants, and both with and without FS USB. Target applications include Audio and low cost graphics. 

Additional Features

      Key Features

      • Up to 72 MHz/116 DMIPS, MIPS32® M4K® core
      • eXtreme Low Power (XLP) Sleep and Deep Sleep 
      • USB 2.0-compliant Full-speed OTG controller
      • Two I2S/SPI modules for Codec and serial communications
      • Peripheral Pin Select (PPS) functionality
      • Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces
      • mTouch™ Capacitive touch
      • Temperature Range - 40°C to 105°C

      Microcontroller Features

      • Operating voltage range of 2.3V to 3.6V
      • 256KB Flash memory (plus an additional 12 KB of Boot Flash)
      • 64KB SRAM memory
      • MIPS16e® mode for up to 40% smaller code size
      • Low-power management modes (Sleep and Idle)

        Peripheral Features

      • Peripheral Pin Select (PPS) functionality to allow function remap
      • 4 channels of hardware DMA with automatic data size detection
        • Two additional DMA channels dedicated to USB
      • Two  UARTs (12.5 Mbps) and two I2C™ modules
      • Hardware Real-Time Clock and Calendar (RTCC)
      • Five 16-bit and up to two 32-bit Timers/Counters
      • Five Capture inputs and Five Compare/PWM outputs

        Audio/Graphics/Touch HMI Features

      • External graphics interface
      • Audio data communication: I2S, LJ, RJ, USB
      • Audio data control interface: SPI and I2C™
      • Audio data master clock:
        • Generation of fractional clock frequencies
        • Can be synchronized with USB clock
        • Can be tuned in run-time
      • Supports mTouch™ capacitive touch sensing

        Advanced Analog Features

      • ADC Module:
        • 10-bit 1Msps rate with one Sample and Hold (S&H)
        • 9 analog inputs
        • Can operate during sleep mode
      • Flexible and independent ADC trigger sources
      • Comparators:
Parametrics
Name
Value
Part Family
PIC32MX2xx
Max CPU Speed MHz
72
Program Memory Size (KB)
256
SRAM (KB)
64
Auxiliary Flash (KB)
12
Temperature Range (C)
-40 to 105
Operating Voltage Range (V)
2.5 to 3.6
Direct Memory Access Channels
6
SPI
2
I2C
2
Hardware Touch Peripheral
CTMU
CODEC Interface (I2S,AC97)
Yes
Peripheral Pin Select / Pin Muxing
Yes
CTMU test
Yes
Number of USB Modules
1
USB Interface
Full Speed
ADC Input
9
Max ADC Resolution (Bits)
10
Max ADC Sampling Rate (ksps)
1100
Input Capture
5
Max 16-bit Digital Timers
5
Parallel Port
EPMP
Number of Comparators
3
Internal Oscillator
1
Hardware RTCC/RTC
Yes
Max I/O Pins
17
Pincount
28
Low Power
Yes

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  • Socket: AC164336   PartNo: PIC32MX274F256B (28MM)
  • Socket: AC164339   PartNo: PIC32MX274F256B (28SO)
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC32MX274F256B-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC32MX274F256B-V/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC32MX274F256BT-V/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC32MX274F256BT-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC32MX274F256B-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC32MX274F256BT-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC32MX274F256BT-V/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC32MX274F256B-V/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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