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ATSAMB11-MR

Bluetooth Low Energy Module

Status: In Production

Features:

  • Bluetooth 5 Certified
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The ATSAMB11-MR is an ultra-low power Bluetooth® Low Energy Module with Integrated MCU, Transceiver, Modem, MAC, PA, TR Switch, and Power Management Unit (PMU).  It is a standalone ARM® Cortex®-M0 applications processor with embedded Flash memory and BLE connectivity.

The qualified Bluetooth Smart protocol stack is stored in dedicated ROM, and the firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT) and the Generic Access Profile (GAP).  Additionally, application profiles such as Proximity, Thermometer, Heart Rate, Blood Pressure, and many others are supported and included in the protocol stack.

The Microchip Bluetooth Data (MBD) mobile app is available to speed up development for both Android and iOS.

Microchip's complimentary and confidential Wireless Check online design review service is available for customers who have selected our products for their application design-in*.
*The online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.

Firmware Release Summary, see Software Release Notes for details:

BluSDK Smart 6.2 - Added PDS service among other bug fixes.

BluSDK Smart 6.1 - Added support for ATSAMB11-XR & ATSAMB11-ZR, fixed issue with multi-link to enable up to 8 links, added support to AES and SHA security cores, among other bug fixes.

BluSDK Smart 5.2 - Added a startup template to provide a simple starting point. Added OTAU (Over The Air Upgrade) support. 

Older versions of BluSDK Smart are not recommended for new designs. 

For product comparison, please consider: ATSAMB11-ZR

Additional Features
  • Bluetooth 5 Certified
  • Lowest BLE power consumption in industry
  • ARM Cortex-M0 with 128KB RAM, 256KB flash
  • Optimized system cost - High level of integration on chip reduces external Bill of Material significantly
  • Wide operating voltage range:  2.3 – 3.6V
  • RoHS compliant
Parametrics
Name
Value
Bluetooth Low Energy
Yes
FCC Certified
Yes
GPIO
30
Pin Count
39
Package Type
Surface mount module
Package Size
22.9 x 15.4 mm
Min Temp Range
-40C
Max Temp Range
+85C
Op Voltage Min
2.3V
Op Voltage Max
3.6V

Documents

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAMB11-MR210CA
2.080000
39
MODULE
xxmm
ENIG
b4
ATSAMB11-MR510CA
2.080000
39
MODULE
xxmm
ENIG
b4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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