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AT28HC256

5V High-Speed 256Kbit (32Kbit x 8) Parallel EEPROM

Status: In Production

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RoHS Information
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Device Overview

Summary

The Microchip AT28HC256 is a high-performance 256Kbit Parallel EEPROM available in both Industrial and Military temp ranges, offering access times to 70ns with power dissipation of 440mW. Deselected, CMOS standby current is less than 5mA. Accessed like static RAM for the read or write cycle without external components, it contains a 64-byte page register to allow writing of up to 64 bytes simultaneously. Features an internal Error Correction Circuit for extended endurance and improved data retention, in Military version. Optional Software Data Protection mechanism guards against inadvertent writes; and an extra 64 bytes of EEPROM enables device identification or tracking.

The AT28HC256 is also available DUAL MARKED where applicable with the appropriate Standard Military Drawing Number - 5962-886340xxx.  See the datasheet for exact MIL product availability.

Additional Features
  • 32 Kbits x 8 (256 Kbit)
  • 5V ± 10% Supply
  • Parallel Interface
  • AT28HC256E - High Endurance 100K Write Cycles Option
  • AT28HC256F - 3 ms Fast Write Option
  • 70ns access time
  • Self-Timed Erase and Write Cycles (10 ms max)
  • Page Write and Byte Write
  • Data Polling for end of write detection
  • Low Power Consumption
  • Read / Write current 80 mA (Max)
  • Standby current TTL 3 mA (Max), CMOS 300 μA (Max)
  • Write-Protection
  • Hardware Protection
  • Software Data Protect
  • Data retention > 10 years
  • Temperature Ranges
  • Standard Temperature Range: -40°C to 85°C
  • Military Temperature Range: -55°C to 125°C
  • Available in Green (Pb/Halide-free) Packaging
  • 32-lead, Plastic J-leaded Chip Carrier (PLCC)
  • 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
  • 28-lead, Plastic Thin Small Outline Package (TSOP)
  • Available in Dual marked (5962-886340xxx) CERAMIC Hermetic Packaging
  • 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
  • 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
  • 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)
Parametrics
Name
Value
Density
256Kb
Op. Volt Range (V)
4.5 to 5.5
Read Access Time
70/90/120ns

Documents

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Data Sheets

Supporting Collateral


Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
AT28HC256-90DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256E-12DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256F-12DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256F-90DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256-12DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256E-90DM/883
0.150000
28
CERDIP
.600In
SnPb
e0
AT28HC256-90LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256E-12LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256F-90LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256-12LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256F-12LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256-90LM/883-696
0.000000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256E-90LM/883
0.150000
32
CLCC
11.4x14x2.54mm
SnPb
e0
AT28HC256E-12UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256-90UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256E-90UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256F-12UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256-12UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256F-90UM/883
0.150000
28
CPGA
13.6x15.1x2.57mm
SnPb
e0
AT28HC256-90FM/883-023
0.000000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256-70JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-90JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-90JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-70JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-12JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-12JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256F-90JU-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-12JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-70JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-90JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-90JU-600
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-70JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-12JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256E-90JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256F-90JU
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
AT28HC256-12TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256E-90TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256E-12TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-70TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256F-90TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-90TU
0.232100
1.696581
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256E-70TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-70TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256E-12TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-12TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256E-90TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256F-90TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-90TU-T
0.232100
0.048000
28
TSOP
8x11.8x1mm
Matte Tin
e3
AT28HC256-12SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256-12SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256-70SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256-90SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256-90SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-12SU-202
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-12SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-90SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256F-90SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-70SU-T
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
AT28HC256-70SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-90SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256F-90SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256E-12SU
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
AT28HC256-12FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256F-90FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256-90FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256E-12FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256F-12FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
AT28HC256E-90FM/883
0.150000
28
Flatpack
10.2x18.3x3.02mm
SnPb
e0
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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