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SST39WF1601

16Mb 1.65-1.95V Parallel Flash

Status: In Production

Features:

  • Organized as 1M x16
  • Single Voltage Read and Write Operations– 1.65-1.95V
  • Bottom Block-Protection (bottom 32 KWord) for SST39WF1601
  • Chip-Erase Time: 140 ms (typical)
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST39WF1601 is a 1M x16 CMOS Multi-Purpose Flash Plus (MPF+) device manufactured with proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and faster erase times compared with alternate approaches. These devices conform to JEDEC standard pin assignments for x16 memories.

Additional Features
  • Organized as 1M x16
  • Single Voltage Read and Write Operations– 1.65-1.95V
  • Superior Reliability
    • Endurance: 100,000 Cycles (Typical)
    • Greater than 100 years Data Retention
  • Low Power Consumption (typical values at 5 MHz)
    • Active Current: 5 mA (typical)
    • Standby Current: 5 µA (typical)
    • Auto Low Power Mode: 5 µA (typical)
  • Hardware Block-Protection/WP# Input Pin
    • Top Block-Protection (top 32 KWord) for SST39WF1602
    • Bottom Block-Protection (bottom 32 KWord) for SST39WF1601
  • Flexible Erase Capabilities
    • Sector-Erase Capability– Uniform 2 KWord sectors
    • Block-Erase Capability– Uniform 32 KWord blocks
    • Chip-Erase Capability
    • Erase-Suspend/Erase-Resume Capabilities
  • Fast Program and Erase Times
    • Block-Erase Time: 36 ms (typical)
    • Word-Program Time: 28 µs (typical)
    • Chip-Erase Time: 140 ms (typical)
    • Sector-Erase Time: 36 ms (typical)
  • Other Features
    • Hardware Reset Pin (RST#)
    • Latched Address and Data
    • Fast Read Access Time – 70 ns
    • Security-ID Feature
    • Packages Available – 48-ball TFBGA (6mm x 8mm), 48-ball WFBGA (5mm x 6mm), 48-ball WFBGA (4mm x 6mm)
Parametrics
Name
Value
Density
16 Mbit
Op. Volt Range (V)
1.65 to 1.95
Read Access Time
70 ns
Temp Range (°C)
-40°C to +85°C
Endurance
100,000

Documents

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Board Design Files


Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST39WF1601-70-4C-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4C-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4I-B3KE-MQ1
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4I-B3KE-MQ1-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39WF1601-70-4C-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39WF1601-70-4C-MAQE-T
0.028700
0.240800
48
WFBGA
4x6x0.73mm
SAC
e1
SST39WF1601-70-4I-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39WF1601-70-4I-MAQE-MQ1
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39WF1601-70-4I-MAQE-MQ1-T
0.028700
0.240800
48
WFBGA
4x6x0.73mm
SAC
e1
SST39WF1601-70-4I-MAQE-T
0.028700
0.240800
48
WFBGA
4x6x0.73mm
SAC
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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