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SST39VF3201C

32Mb 2.7-3.6V Parallel Flash

Status: In Production

Features:

  • Organized as 2M x16
  • Low Power Consumption (typical values at 5 MHz) – Active Current: 6 mA (typical) – Standby Current: 4 µA (typical) – Auto Low Power Mode: 4 µA (typical)
  • Hardware Block-Protection/WP# Input Pin – Top Block-Protection (top two 4-KWord blocks) for SST39VF3202C – Bottom Block-Protection (bottom two 4-KWord blocks) for SST39VF3201C
  • Sector-Erase Capability – Uniform 2 KWord sectors
  • Block-Erase Capability – Flexible block architecture – Eight 4-KWord blocks, 63 32-KWord blocks
  • Chip-Erase Capability
  • Erase-Suspend/Erase-Resume Capabilities
  • Hardware Reset Pin (RST#)
  • Security-ID Feature – SST: 128 bits; User: 128 words
  • Fast Erase and Word-Program: – Sector-Erase Time: 18 ms (typical) – Block-Erase Time: 18 ms (typical) – Chip-Erase Time: 35 ms (typical) – Word-Program Time: 7 µs (typical)
  • Packages Available – 48-lead TSOP (12mm x 20mm) – 48-ball TFBGA (6mm x 8mm)
  • All non-Pb (lead-free) devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST39VF3201C is 2M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST’s proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF3201C write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC standard pin assignments for x16 memories.

Additional Features
  • Organized as 2M x16
  • Low Power Consumption (typical values at 5 MHz)– Active Current: 6 mA (typical)– Standby Current: 4 µA (typical)– Auto Low Power Mode: 4 µA (typical)
  • Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top two 4-KWord blocks)for SST39VF3202C– Bottom Block-Protection (bottom two 4-KWordblocks) for SST39VF3201C
  • Sector-Erase Capability– Uniform 2 KWord sectors
  • Block-Erase Capability– Flexible block architecture– Eight 4-KWord blocks, 63 32-KWord blocks
  • Chip-Erase Capability
  • Erase-Suspend/Erase-Resume Capabilities
  • Hardware Reset Pin (RST#)
  • Security-ID Feature– SST: 128 bits; User: 128 words
  • Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 35 ms (typical)– Word-Program Time: 7 µs (typical)
  • Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)
  • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
32 Mbit
Op. Volt Range (V)
2.7 to 3.6
Read Access Time
70 ns
Temp Range (°C)
-40°C to +85°C
Endurance
100,000

Documents

Jump to:

Brochures

12/19/2017
3698KB
10/06/2014
3370KB

Software

IBIS

01/29/2013
18KB

Product Brief

Product Line Card

Brochures

09/19/2012
740KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST39VF3201C-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF3201C-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF3201C-70-4I-B3KE-T-VAO
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF3201C-70-4I-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF3201C-70-4I-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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