Microchip Technology Inc
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SST26VF064BA

64Mb 2.3-3.6V Serial Quad I/O (SQI) Flash

Status: In Production

Features:

  • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3,
  • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
  • Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
  • Page-Program- 256 Bytes per page in x1 or x4 mode
  • Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
  • Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
  • Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical)
  • Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC (208 mil), 16-lead SOIC (300 mil), 24-ball TBGA (6mm x 8mm)
  • Serial Flash Discoverable Parameters (SFDP)
  • All devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST26VF064BA Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. SST26VF064BA also support full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol. Operating at frequencies reaching 104 MHz, the SST26VF064BA enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. The device’s high performance and reliability make it the ideal choice for Network Appliance, DSL and Cable Modems, Wireless Lan, Computing, Digital TV, Smart Meter, Server, Set Top Box, Automotive and other Industrial applications. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability, and lowers power consumption for high bandwidth, compact designs.

The SST26VF064B default at power up is with WP# and HOLD pins enable and SIO2 and SIO3 pins disable allowing for SPI protocol operations without register configuration.
The SST26VF064BA default at power up with WP# and HOLD pins disable and SIO2 and SIO3 pins enable allowing for Quad I/O operations without register configuration.

Additional Features
    • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3,
    • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
    • Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
    • Page-Program- 256 Bytes per page in x1 or x4 mode
    • Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
    • Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
    • Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical)
    • Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC (208 mil), 16-lead SOIC (300 mil), 24-ball TBGA (6mm x 8mm)
    • Serial Flash Discoverable Parameters (SFDP)
    • All devices are RoHS compliant
Parametrics
Name
Value
Density
64 Mbit
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
104 MHz
Page Size (bytes)
256
Write Protect
Full Array
Temp Range (°C)
-40°C to +85°C
Endurance
100,000
Data Retention (Years)
100
Bus Modes
SPI,SDI,SQI

Documents

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Brochures

12/19/2017
3698KB

Device Documentation

Technical Briefs

Product Selection Tools

Software

12/10/2014
119KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST26VF064BA-104I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF064BAT-104I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF064BA-104I/SO
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
SST26VF064BAT-104I/SO
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
SST26VF064BA-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF064BAT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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