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PL133-97

Status: In Production

Features:

  • 1:9 LVCMOS output fanout buffer for DC to 150MHz
  • 8mA Output Drive Strength
  • Low power consumption for portable applications
  • Low input-output delay
  • Output-Output skew less than 250ps
  • Low Additive Phase Jitter of 60fs RMS
  • 1.8V to 3.3V ±10% operation
  • Operating temperature range from -40°C to 85°C
  • Available in 16-Pin QFN GREEN/RoHS package
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The PL133-97 is an advanced fanout buffer design for high performance, low-power, small form factor applications. The PL133-97 accepts a reference clock input from DC to 150 MHz and provides 9 outputs of the same frequency.The PL133-97 is offered in a QFN-16L 3mm x 3mm package and it offers the best phase noise, additive jitter performance, and lowest power consumption of any comparable IC. The PL133-97 outputs can be disabled to a high impedance (tri-state) by pulling low the OE pin. When the OE pin is high, the outputs are enabled and follow the REF input signal. When the OE pin is left open, a pull-up resistor on the chip will default the OE pin to logic 1 so the outputs are enabled.

Additional Features
    • 1:9 LVCMOS output fanout buffer for DC to 150MHz
    • 8mA Output Drive Strength
    • Low power consumption for portable applications
    • Low input-output delay
    • Output-Output skew less than 250ps
    • Low Additive Phase Jitter of 60fs RMS
    • 1.8V to 3.3V ±10% operation
    • Operating temperature range from -40°C to 85°C
    • Available in 16-Pin QFN GREEN/RoHS package
Parametrics
Name
Value
Product Type
Fanout & Buffer and Drivers
Description
1:9 CMOS Fanout Buffer 1.8-3.3V
Input
LVCMOS
Output
LVCMOS
Supply Voltage
2.5/3.3
Max Freq (GHz)
0.15
Max Prop Delay (ps)
9200
Max Within Device Skew (ps)
250
OE
True
RPE
False
FSI
False
Input Mux
False
Input EQ
False
Voltage (V)
1.8/2.5/3.3
Output Type
LVCMOS
Input (MHz)
DC
Number Of Outputs
9
Output Voltage
1.8/2.5/3.3

Documents

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PL133-97QC
0.021400
0.150000
16
VQFN
3x3x0.9mm
NiPdAu
e4
PL133-97QC-R
0.021400
0.516430
16
VQFN
3x3x0.9mm
NiPdAu
e4
PL133-97QI
0.021400
0.150000
16
VQFN
3x3x0.9mm
NiPdAu
e4
PL133-97QI-R
0.021400
0.516430
16
VQFN
3x3x0.9mm
NiPdAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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