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MTCH6102

Status: In Production

Features:

  • Up to 15 total channels
  • Sensor sizes up to 120mm (4.7”)
  • Individual channel tuning for optimal sensitivity
  • Works with printed circuit boards (PCB) sensors, film, glass, and flexible printed circuits (FPC) sensors.
  • Plastic: up to 3 mm
  • Glass: up to 5 mm
  • >200 reports per second (configurable)
  • 12-bit resolution coordinate reporting
  • Gesture detection and reporting
  • Self capacitance signal acquisition
  • Multiple built-in filtering options
  • Configurable sleep/idle framerates
  • Standby mode <500nA (typical)
  • Active mode <12uA possible
  • I2C (400kbps)
  • Both polling and interrupt schemes supported
  • Sync signal allows for host frame detection
  • Field upgradable over I2C
  • 1.8V to 3.6V
  • -40ºC to +85ºC
  • 28 Pin SSOP
  • 28 Pin UQFN
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

Microchip’s MTCH6102 is a turnkey projected capacitive touch controller that simplifies adding gestures to touch interface designs with industry-leading low power performance.  Utilize up to 15 channels to support taps, swipes, and scrolling on XY touch pads and touch screens. 

The MTCH6102 allows designers to quickly and easily integrate projected capacitive touch into their cost sensitive, low power application.  The MTCH6102 provides developers with a flexible touch sensing solution to optimize common constraints of size, power and cost that are critical to applications such as wearable devices, remote controls, gaming devices and track pads.  

Additional Features

    Touch Sensor Support

    • Up to 15 total channels
    • Sensor sizes up to 120mm (4.7”)
    • Individual channel tuning for optimal sensitivity
    • Works with printed circuit boards (PCB) sensors, film, glass, and flexible printed circuits (FPC) sensors.

    Cover layer support:

    • Plastic: up to 3 mm
    • Glass: up to 5 mm

    Touch Performance

    • >200 reports per second (configurable)
    • 12-bit resolution coordinate reporting

    Touch Features

    • Gesture detection and reporting
    • Self capacitance signal acquisition
    • Multiple built-in filtering options

    Power Management

    • Configurable sleep/idle framerates
    • Standby mode <500nA (typical)
    • Active mode <12uA possible

    Communication Interface

    • I2C (400kbps)
    • Both polling and interrupt schemes supported
    • Sync signal allows for host frame detection
    • Field upgradable over I2C

    Operating Conditions

    • 1.8V to 3.6V
    • -40ºC to +85ºC

    Package Types

    • 28 Pin SSOP
    • 28 Pin UQFN

Parametrics
Name
Value
Product Type
Projected Capacitive Controller
Input Channels
15
Measurement Principle
Self Capacitance
Report Rate (pps)
200
Number of Touches
1
Position Resolution
12-Bit
Interface
I2C
Features
Gestures
Voltage Range
1.80V - 3.60V

Documents

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Brochures

Software

09/18/2014
8046KB
05/02/2014
9876KB

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
Low Power Projected Capacitive Touch Pad Development Kit
Low Power Projected Capacitive Touch Pad Development Kit ( DM160219 )

Microchip's Low Power Projected Capacitive Touch Pad Development Kit enables designers to quickly integrate gestures and XY touch to their designs. The kit includes everything needed to create a rich user interface, including a USB connection to our GUI for customized solutions. Gestures and PCap touch are supported by MTCH6102, Microchip’s turnkey PCap touch controller.

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Large Sensor Support

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MTCH6102-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
MTCH6102T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
MTCH6102-I/MV
0.026100
0.109890
28
UQFN
4x4x0.55mm
Matte Tin
e3
MTCH6102T-I/MV
0.026100
0.212121
28
UQFN
4x4x0.55mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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