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MCP9805

Status: In Production

Features:

  • Meets JEDEC JC42.4 Mobile Platform Memory Module Thermal Sensor specification
  • Critical Event output pin
  • User-programmalbe settings for shutdown modes, Event and critical output limits, and hysteresis limits
  • Resolution of 0.25°C per LSB
  • ±1°C Max accuracy from +75°C to +95°C
  • ±2°C Max accuracy from +40°C to +125°C
  • ±3°C Max accuracy from -20°C to +125°C
  • Low Operating Current: 200 µA (typical)
  • 2-wire I²C™/SMBus Compatible Interface
  • 8-pin TSSOP and 2mm x 3mm 8-pin DFN Packages
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Additional Features
    • Meets JEDEC JC42.4 Mobile Platform Memory Module Thermal Sensor specification
    • Critical Event output pin
    • User-programmalbe settings for shutdown modes, Event and critical output limits, and hysteresis limits
    • Resolution of 0.25°C per LSB
    • ±1°C Max accuracy from +75°C to +95°C
    • ±2°C Max accuracy from +40°C to +125°C
    • ±3°C Max accuracy from -20°C to +125°C
    • Low Operating Current: 200 µA (typical)
    • 2-wire I²C™/SMBus Compatible Interface
    • 8-pin TSSOP and 2mm x 3mm 8-pin DFN Packages
Parametrics
Name
Value
# Temps Monitored
1
Typical Accuracy (°)
2
Max. Accuracy @ 25° (°)
3
Max Input/ Supply Current (µA)
200
Temp. Range (°C)
-40 to +125
Operating Voltage Range (V)
+3.0 to +3.6
Typ Supply Current (µA)
200
Alert/THERM
1
Resistance Error Correction
N/A
Beta Compensation
N/A
Ideality Factor
N/A
Device Description
Digital Temperature Sensor

Documents

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Data Sheet

02/05/2013
485KB

Application Notes

Product Line Card

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP9805-BE/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
MCP9805T-BE/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
MCP9805-BE/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
MCP9805T-BE/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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