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MCP47CMB01

Mixed Signal Products

Status: In Production

Features:

  • 8-Bit Resolutions
  • I2C Interface
  • Operating Voltage Range: 2.7V to 5.5V
  • 1 LSb Integral Nonlinearity (INL) Specification
  • Fast Settling Time of 16 μs (typ)
  • Nonvolatile Memory (MTP) Size: 32 Locations
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

MCP47CMB01 is a single channel, 8-bit, buffered voltage output Digital-to-Analog Converter (DAC) with MTP memory and an I²C Compatible Serial Interface. This  device provides four different voltage reference options: device VDD, external VREF (Buffered or unbuffered) and internal bandgap. It offers 1 LSB Integral Non-Linearity (INL) with low power consumption and fast settling time of 6µs. This device has integrated MTP memory that can be written up to 32 times, for reach specific register. It is suitable for consumer and industrial applications, such as set point or offset trimming, sensor calibrations and motor control applications.


For different resolutions and number of output channels, please check out our other parts in the MCP47CMBxx family.

Additional Features
  • 8-Bit Resolutions
  • I2C Interface
  • Operating Voltage Range: 2.7V to 5.5V
  • 1 LSb Integral Nonlinearity (INL) Specification
  • Fast Settling Time of 16 μs (typ)
  • Nonvolatile Memory (MTP) Size: 32 Locations
  • Power-on/Brown-out Reset (POR/BOR) Protection
  • DAC Voltage Reference Options:
  • Device VDD
  • External VREF pin (buffered or unbuffered)
  • Internal band gap (1.227V typical)
  • Package Types:
  • 16-lead 3x3 QFN, 10-lead MSOP, 10-lead 3x3 DFN
  • Temperature: -40°C to +125°C
Parametrics
Name
Value
Typical Operating Current (µA)
400
Resolution (Bits)
8
DACs per Package
1
Output Settling Time (µs)
16
DNL (LSB)
0.1
Temp. Range (°C)
-40°C to +125°C
Interface
I²C™

Documents

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Data Sheets

  
8862KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP47CMB01-E/UN
0.023200
0.060000
10
MSOP
3x3mm
Matte Tin
e3
MCP47CMB01T-E/UN
0.023200
0.200000
10
MSOP
3x3mm
Matte Tin
e3
MCP47CMB01-E/MG
0.021600
0.041667
16
QFN
3x3x0.9mm
Matte Tin
e3
MCP47CMB01T-E/MG
0.021600
0.234849
16
QFN
3x3x0.9mm
Matte Tin
e3
MCP47CMB01-E/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
MCP47CMB01T-E/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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