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IS2066

Status: Samples Available

Features:

  • Bluetooth 5.0 compliant
  • Wireless Stereo Technology (WST) for earbuds
  • ROM only
  • 3.5x5 BGA package
  • EEPROM for DSP customization
  • Easy to use configuration tools
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The IS2066B is a low power Bluetooth Audio System-on-Chip (SoC) with Microchip’s Wireless Stereo Technology (WST) for Bluetooth Audio applications targeting wireless earbuds. The IS2066B product is part of the Bluetooth Dual mode family of stereo audio devices. It allows audio playback on two wireless devices. It includes an internal EEPROM for DSP customization. The IS2066 comes in a compact 3.5 x 5 BGA package.

Additional Features
  • Bluetooth 5.0 compliant
  • Wireless Stereo Technology (WST) for earbuds
  • ROM only
  • 3.5x5 BGA package
  • EEPROM for DSP customization
  • Easy to use configuration tools
Parametrics
Name
Value
Bluetooth Classic-Data/SPP
Yes
Bluetooth Classic-Audio
Yes
Bluetooth Low Energy
Yes
Audio Channels
Stereo
Analog Audio Out
Yes
Digital Audio Out
Yes
MIC-in
1
Line-in
Yes
GPIO
15
Package Size
3.5x5 BGA
Temperature Range
-20 C to +70 C
Operating Voltage Range
3.2 V to 4.2 V

Documents

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Supporting Collateral

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
BM64 Bluetooth Audio Evaluation Board
BM64 Bluetooth Audio Evaluation Board ( BM-64-EVB-C1 )

The BM-64-EVB-C1 enables the user to evaluate and demonstrate the functionality of the BM64 Class 1 stereo audio module. The BM-64-EVB-C1 includes an integrated configuration and programming interface for plug-and-play capability, and also has status LEDs which enable rapid prototyping and faster time to market.

Along with the BM-64-EVB-C1, software tools and applications are...

Learn More
Add To Cart
BM64 Bluetooth Audio Evaluation Board
BM64 Bluetooth Audio Evaluation Board ( BM-64-EVB-C2 )

The BM-64-EVB-C2 enables the user to evaluate and demonstrate the functionality of the BM64 Class 2 stereo audio module. The BM-64-EVB-C2 includes an integrated configuration and programming interface for plug-and-play capability, and also has status LEDs which enable rapid prototyping and faster time to market.

Along with the BM-64-EVB-C2, software tools and applications are...

Learn More
Add To Cart

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
IS2066B-236-TRAY
0.375510
50
VFBGA
5x3.5x0.9mm
SAC305
e1
IS2066B-236
0.138000
50
VFBGA
5x3.5x0.9mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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