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ATSAML11D16A

Status: In Production

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Device Overview

Summary

Industry’s first and lowest power Arm® Cortex®-M23 featuring chip-level security and ARM® TrustZone® Technology, consuming less than 25uA/MHz in active mode and less than 100 nA in sleep mode. It features secure key storage, chip-level tamper resistance, crypto accelerators, secure boot, secure bootloader, enhanced peripheral touch controller, advanced analog, ISO7816 smart card interface, event system and SleepWalking peripherals.
SAM L11 achieved EEMBC Certified ULPMark Core Profile score of 410 & Peripheral Profile score of 167.

SAML11-KPH variants (Example part#: ATSAML11D16A-MUKPH) are pre-provisioned with Trustonic Root of Trust key and are supported by Kinibi-M Software Development Kit.

SAML11 variants have the option to be securely key provisioned using Secure Thingz Secure Deploy™ Architecture.


Supported by MPLAB X IDE and MPLAB Harmony.

Additional Features
  • Processor:
    • ARM Cortex®-M23
    • 32 MHz (2.62 CoreMark/MHz and up to 31 DMIPS)
    • Single-cycle hardware multiplier
    • Hardware divider
    • Nested Vector Interrupt Controller (NVIC)
    • Memory Protection Unit (MPU)
  • Operating Voltage Range:
    • 1.62V to 3.63V
  • Memory:
    • 64 KB Flash
    • 16 KB SRAM
    • 2 KB Data Flash section for non-volatile data storage
    • 256 bytes TrustRAM with physical protection features
  • Ultra-Low Power:
    • Active, Idle, Standby with partial or full SRAM retention and off sleep modes
    • Active mode (< 25 μA/MHz)
    • Idle mode (< 10 μA/MHz) with 1.5 μs wake-up time
    • Standby with Full SRAM Retention (0.5 μA) with 5.3 μs wake-up time
    • Off mode (< 100 nA)
  • Security:
    • Secure Boot with SHA-based authentication
    • Arm TrustZone for flexible hardware isolation of memories and peripherals
    • AES-128, SHA-256, and GCM cryptography accelerators
    • Chip-level tamper detection to resist microprobing attacks
    • Silent access for side channel attack resistance
    • Rapid Tamper Erase on scrambling key and RAM data
    • Data remanence prevention
    • Address and Data scrambling with user-defined key
    • One True Random Generator (TRNG)
  • Enhanced Peripheral Touch Controller (PTC):
    • Driven Shield Plus for moisture tolerance and noise immunity
    • Parallel Acquisition through Polarity control
    • Supports wake-up on touch from Standby Sleep mode
  • Advanced Analog:
    • 12-bit, 1 MSPS Analog-to-Digital Converter (ADC)
    • Analog Comparators (AC) with window compare function
    • 10-bit, 350 KSPS DAC with external and internal outputs
    • Operational Amplifiers
  • Serial Communication Interfaces (SERCOM) that can operate as:
    • USART, I2C, SPI
  • Qualification and Class-B Support:
    • AEC-Q100 REVH (Grade 1 [-40ºC to +125ºC]) (planned)
    • Class-B safety library, IEC 60730 (planned)
  • Temperature options:
    • -40 C to 85 C
    • -40 C to 125 C
  • Debugger Development Support:
    • Two-pin Serial Wire Debug (SWD) programming and debugging interface
Parametrics
Name
Value
Part Family
SAM L11
Max CPU Speed MHz
32
Program Memory Size (KB)
64
SRAM (KB)
16
Data EEPROM/HEF (Bytes)
2048
Secure Boot
Yes
Arm® TrustZone®
Yes
Crypto Engine
Yes
Secure Key Storage
Yes
Secure Bootloader
Yes
Secure Debug
Yes
Temperature Range (C)
-40 to 125
Operating Voltage Range (V)
1.62 to 3.63
Direct Memory Access Channels
8
SPI
2
I2C
2
Hardware Touch Peripheral
PTC
Water Tolerant Touch
Yes
Driven Shield Plus
Yes
Parallel Acquisition
Yes
Number of Op Amps
3
Peripheral Pin Select / Pin Muxing
Yes
ADC Input
5
Max ADC Resolution (Bits)
12
Max ADC Sampling Rate (ksps)
1000
Number of DACs
1
Input Capture
6
Standalone Output Compare/Standard PWM
6
Max 16-bit Digital Timers
3
Parallel Port
GPIO
Number of Comparators
1
Internal Oscillator
32Khz ULP, 16Mhz
Hardware RTCC/RTC
Yes
Max I/O Pins
17
Pincount
24
Low Power
Yes

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAML11D16A-MF
0.041400
0.389796
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MU
0.041400
0.389796
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MUT
0.041400
0.272167
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MFKPH
0.041400
0.389796
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MFTKPH
0.041400
0.272167
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MUKPH
0.041400
0.389796
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MUTKPH
0.041400
0.272167
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MFT
0.041400
0.272167
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-YF
0.186500
0.389831
24
SSOP
.209in
Matte Tin
e3
ATSAML11D16A-YFT
0.186500
0.436191
24
SSOP
.209in
Matte Tin
e3
ATSAML11D16A-YU
0.186500
0.389831
24
SSOP
.209in
Matte Tin
e3
ATSAML11D16A-YUT
0.186500
0.436191
24
SSOP
.209in
Matte Tin
e3
ATSAML11D16A-MZT
0.049100
0.125000
24
VQFN
4x4x0.9mm
Matte Tin
e3
ATSAML11D16A-MZ
0.049100
0.000000
24
VQFN
4x4x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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