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ATSAMG55J19A

Status: In Production

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Overview
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Device Overview

Summary

For new designs, please consider Revision B ATSAMG55J19B.

The Microchip's SAM G55 embeds a Cortex-M4 CPU with an FPU (floating point unit). This ensures maximum throughput. This is very important as it allows you to minimize the active power consumption and get to sleep faster in order to reduce the overall power consumption. Additionally, the devices have 30 DMA channels, which give extremely high throughput.

The combination of ultra-low power consumption, fast wake-up time and high throughput is what gives the SAM G the edge in space- and power-constrained consumer applications such as sensor hubs. It wakes up quickly, has the throughput needed to reduce the amount of time spent in active mode, and then goes back to sleep with SRAM retention to conserve energy.

This gives the best performance and longest battery lifetime. It is fully-functional all the way down to 1.6V; including flash reads and writes, as well as full ADC operation. This allows for a more flexible power supply scheme that will squeeze extra runtime out of a battery.


Supported by MPLAB X IDE and MPLAB Harmony.

Additional Features
  • Additional Features
  • Key Features
    • picoPower
    • Down to 100 µA/MHz in active
    • Below 7 µA in deep sleep with SRAM retention
    • Down to 3 µs wake-up from deep sleep to executing the first instruction in active mode
    • Increased throughput
    • Cortex-M4
    • FPU
    • Small package
    • 3x3 mm w/ 0.4mm pitch, WLCSP 7x7 pins
    • Pin compatibility across the family
    • Microcontroller Features
    • Core
    • ARM Cortex-M4 with up to 16 Kbytes SRAM on I/D bus providing 0 wait state execution at up to 120 MHz
    • Memory Protection Unit (MPU)
    • DSP Instructions, Floating Point Unit (FPU), Thumb®-2 instruction set
    • Memories
    • Up to 512 Kbytes embedded Flash
    • Up to 176 Kbytes embedded SRAM
    • 8 Kbytes ROM with embedded boot loader, single-cycle access at full speed
    • System
    • Embedded voltage regulator for single-supply operation
    • Power-on reset (POR) and Watchdog for safe operation
    • Quartz or ceramic resonator oscillators: 3 to 20 MHz with clock failure detection and 32.768 kHz for RTT or system clock
    • High-precision 8/16/24 MHz factory-trimmed internal RC oscillator. In-application trimming access for frequency adjustment
    • Slow clock internal RC oscillator as permanent low-power mode device clock
    • PLL range from 48 MHz to 120 MHz for device clock
    • PLL range from 24 MHz to 48 MHz for USB device and USB OHCI
    • Up to 30 peripheral DMA (PDC) channels
    • 256-bit General-Purpose Backup Registers (GPBR)
    • 16 external interrupt lines
    • Package
    • 49-lead WLCSP, 64-lead LQFP, 64-lead QFN
    • Temperature operating range
    • Industrial (-40° C to +85° C)
    • Peripheral Features
    • 8 flexible communication units supporting:
    • USART, SPI, or Two-wire Interface (TWI)
    • USB 2.0 Device and USB Host OHCI with On-chip Transceiver
    • 2 Inter-IC Sound Controllers (I2S)
    • 2 three-channel 16-bit Timer/Counters (TC) with capture, waveform, compare and PWM modes
    • 1 48-bit Real-Time Timer (RTT) with 16-bit prescaler and 32-bit counter
    • 1 RTC with calendar and alarm features
    • 1 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU)
    • I/O
    • Up to 48 I/O lines with external interrupt capability (edge or level), debouncing, glitch filtering and on-die series resistor termination. Individually programmable open-drain, pull-up and pull-down resistor and synchronous output
    • Two PIO Controllers provide control of up to 48 I/O lines
    • Audio Features
    • 1 Pulse Density Modulation Interface (PDMIC) (supports up to two microphones)
    • Advanced Analog Features
    • 12-bit ADC Module:
    • One 8-channel ADC, 500 kSps Conversion Rate
    • 12-bit Resolution with Enhanced Mode up to 16 bits
    • Digital Averaging Function providing Enhanced Resolution Mode up to 16 bits
    • Integrated Multiplexer Offering Up to 8 Independent Analog Inputs
    • Standby Mode for Fast Wakeup Time Response
    • Asynchronous Partial Wake-up (Sleepwalking) on external trigger
    • Debugger Development Support
    • Serial Wire/JTAG Debug Port(SWJ-DP)
    • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.
    • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.
    • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.
    • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.
    • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.
    • IEEE1149.1 JTAG Boundary-scan on all digital pins.
    • Integrated Software Libraries and Tools
    • ASF-Atmel software Framework – SAM software development framework
    • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.
    • DMA support, Interrupt handlers Driver support
    • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks
    • Image formats, file system & GUI library Middleware
    • RTOS integration, FreeRTOS a core component
Parametrics
Name
Value
Part Family
ATSAMG55
Max CPU Speed MHz
120
Program Memory Size (KB)
512
SRAM (KB)
176
Auxiliary Flash (KB)
0.512
Temperature Range (C)
-40 to 85
Operating Voltage Range (V)
1.62 to 3.6
Direct Memory Access Channels
30
SPI
8
I2C
8
Peripheral Pin Select / Pin Muxing
Yes
Number of USB Modules
1
USB Interface
Full Speed
ADC Input
8
Max ADC Resolution (Bits)
12
Max ADC Sampling Rate (ksps)
800
Input Capture
12
Max 16-bit Digital Timers
6
Internal Oscillator
8,16,24Mhz,32Khz
Hardware RTCC/RTC
Yes
Max I/O Pins
48
Pincount
64
Low Power
Yes

Documents

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Development Environment

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAMG55J19A-MU
0.159900
0.988462
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
ATSAMG55J19A-MUT
0.159900
0.502857
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
ATSAMG55J19A-MUTN01
0.159900
0.502857
64
VQFN
7.5x7.5x0.9mm
Matte Tin
e3
ATSAMG55J19A-AU
0.368300
1.087500
64
LQFP
10x10x1.4mm
Matte Tin
e3
ATSAMG55J19A-AUT
0.368300
0.366667
64
LQFP
10x10x1.4mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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