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ATA6617C

LIN System in Package SiP (ATA6624C + ATtiny167 µC)

Status: In Production

Features:

  • Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog
  • Very Low Current Consumption in Sleep Mode
  • 16Kbytes Flash Memory for Application Program
  • Supply Voltage Up to 40V
  • Operating Voltage: 5V to 27
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chip (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices.

Additional Features
    • Single-package High Performance, Low Power AVR 8-bit Microcontroller with LIN Transceiver, 5V Regulator (85mA Current Capability) and Watchdog
    • Very Low Current Consumption in Sleep Mode
    • 16Kbytes Flash Memory for Application Program
    • Supply Voltage Up to 40V
    • Operating Voltage: 5V to 27
Parametrics
Name
Value
Description
LIN System-in-Package (SiP)
Vreg Output Voltage Options (V)
5.0 -
Vreg Output Current (mA)
85
Max. Baud Rate (kBaud)
20
Vcc Range (V)
5 to 27
Integrated VREG
Yes
Integrated WWDT
Yes

Documents

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Development Environment

  • Production Programmers
Production Programmers
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Vcc Range
Vreg Output Voltage V
LIN Spec Supported
Price 5K
5 - 27
5.0 -
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$2.16
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3.3 -
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3.3 -
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5.0 -
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$0.52
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5.0 -
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$0.52
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5.0 -
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3.3 -
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$0.57
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5.0 -
2.0, 2.1, 2.2, 2.2A, SAEJ2602-2
$0.57
5 - 28
3.3 -
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$0.57
5 - 28
5.0 -
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-
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATA6617C-P3QW-1
0.098200
0.275000
38
VQFN
5x7x1mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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