BZPACK mSiC^® Power Modules

Compact BZPACK power module for space‑constrained designs

• Footprint: 33.8 × 62.8 mm
• Form factor: Baseplate‑less, compact package
• Power focus: Optimized for lower to mid‑power and current levels
• Assembly: Press‑fit, solderless terminals
• Substrates: Al₂O₃ and AlN options

High‑power BZPACK solution for demanding applications

• Footprint: 58.5 × 65 mm
• Form factor: Baseplate‑less package with increased power handling
• Power focus: Supports higher current and higher power density designs
• Assembly: Press‑fit, solderless terminals
• Substrates: Al₂O₃ and AlN options

• Engineered to exceed High-Humidity, High-Voltage, High-Temperature Reverse-Bias (HV-H3TRB) standards for robust performance and long-term reliability in harsh, high-moisture and high-temperature environments
• Proven reliability with successful operation beyond 3,000 hours, surpassing the industry standard of 1,000 hours

• Baseplate-less, compact design with industry-standard footprints for easy integration and multi-sourced compatibility
• Press-fit, solderless assembly and pre-applied Thermal Interface Material (TIM) simplify manufacturing, reduce errors and speed up time to market
• Designed for high-volume manufacturing, enabling scalable and future-proof solutions

• Available with Aluminum Oxide (Al₂O₃) and Aluminum Nitride (AlN) substrates for optimized thermal performance
• High CTI 600 case provides excellent insulation and protection against contamination

• Supports multiple topologies, including half-bridge, full bridge, three-phase and boost chopper configurations
• Integrated gate resistors and stable R_DS(on) across temperature ranges deliver high efficiency and consistent performance
• Suitable for renewable energy systems, industrial power, heavy transportation, aerospace and defense applications