Tiny, Four-Ball WLCSP EEPROMs

Add more functionality to your design while taking up less space with these Wafer-Level Chip-Scale Package (WLCSP) EEPROM devices. These memory devices reduce the industry-standard 8-pin pinout to only four pins by eliminating all pins needed for I²C addressing and write protection. The I²C address is preset at the factory, and block-by-block write protection is accomplished by software. All densities are available in four-ball flip-chip wafer scale packaging, providing dimensions as small as 0.5 mm² for when tiny really matters.