Microchip Technology Inc

USB3300

In Production

The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver (PHY). The USB3300 uses a low pin count interface (ULPI) to connect to a ULPI compliant Link layer. The ULPI interface reduces the UTMI+ interface from 54 pins to 12 pins using a method of in-band signaling and status byte transfers between the Link and PHY.

This PHY was designed from the start with the ULPI interface. No UTMI to ULPI wrappers are used in this design which provides a seamless ULPI to Link interface. The result is a PHY with a low latency transmit and receive time. Microchip's low latency high speed and full speed receiver provide the option of re-using existing UTMI Links with a simple wrapper to convert UTMI to ULPI.

The ULPI interface allows the USB3300 PHY to operate as a device, host, or an On-The-Go (OTG) device. Designs using the USB3300 PHY as a device, can add host and OTG capability at a later date with no additional pins.

The ULPI interface, combined with Microchip's proprietary technology, makes the USB3300 the ideal method of adding Hi-Speed USB to new designs. The USB3300 features an industry leading small footprint package (5mm by 5mm) with sub 1mm height. In addition the USB3300 integrates all DP and DM termination resistances and requires a minimal number of external components.


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    Features

        Features

        • USB-IF Hi-Speed certified to the Universal Serial Bus Specification Rev 2.0
        • Interface compliant with the ULPI Specification revision 1.1 in 8-bit mode
        • Industry standard UTMI+ Low Pin Interface (ULPI) Converts 54 UTMI+ signals into a standard 12 pin Link controller interface
        • 54.7mA Unconfigured Current (typical) - ideal for bus powered applications
        • 83uA suspend current (typical) - ideal for battery powered applications
        • Latch-Up performance exceeds 150 mA per EIA/JESD 78, Class II
        • ESD protection levels of ±8kV HBM without external protection devices
        • Integrated protection to withstand IEC61000-4-2 ESD tests (±8kV contact and ±15kV air) per 3rd party test facility
        • Supports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3)
        • Supports HS SOF and LS keep-alive pulse
        • Includes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Supplement Revision 1.0a specification
        • Supports the OTG Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
        • Allows host to turn VBUS off to conserve battery power in OTG applications
        • Supports OTG monitoring of VBUS levels with internal comparators. Includes support for an external VBUS or fault monitor.
        • Low Latency Hi-Speed Receiver (43 Hi-Speed clocks Max) allows use of legacy UTMI Links with a ULPI wrapper
        • Integrated Pull-up resistor on STP for interface protection allows a reliable Link/PHY start-up with slow Links (software configured for low power)
        • Internal 1.8 volt regulators allow operation from a single 3.3 volt supply
        • Internal short circuit protection of ID, DP and DM lines to VBUS or ground
        • Integrated 24MHz Crystal Oscillator supports either crystal operation or 24MHz external clock input
        • Internal PLL for 480MHz Hi-Speed USB operation
        • Industrial Operating Temperature -40°C to +85°C
        • 32 pin, QFN RoHS Compliant package (5 x 5 x 0.90 mm height)

        Applications

        The USB3300 is the ideal companion to any ASIC, SoC or FPGA solution designed with a ULPI Hi-Speed USB host, peripheral or OTG core.

        The USB3300 is well suited for:

        • Cell Phones
        • PDAs
        • MP3 Players
        • Scanners
        • External Hard Drives
        • Digital Still and Video Cameras
        • Portable Media Players
        • Printers
    Parameter Name
    Value
    Description
    USB 2.0 ULPI PHY IC with OTG
    Upstream Port
    ULPI
    Reference Clock Freq
    24MHz
    I/O Voltage (V)
    3.3V
    Crystal Support
    Yes
    OTG
    Yes
    Temp. Range Min.
    -40
    Temp. Range Max.
    85
    Documentation
    Data Sheets
    06/30/2016
    998KB
      Application Notes
     
     
     
    AppNote
    04/25/2014
    636KB
    AppNote
    04/25/2014
    375KB
    AppNote
    08/10/2015
    386KB
      IBIS
     
     
     
    IBIS
    06/30/2006
    68KB
    IBIS
    06/30/2006
    325KB
    IBIS
    06/30/2006
    274KB
      Product Briefs
     
     
     
     
    Product Briefs
    01/24/2013
    301KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    USB3300-EZK
    32
    VQFN
    -40C to +85C
    TRAY
    1.24
    1.04
    0.94
    0.91
    0.90
    USB3300-EZK-CAG
    32
    VQFN
    -40C to +85C
    TRAY
    1.36
    1.14
    1.03
    1.00
    0.99
    USB3300-EZK-TR
    32
    VQFN
    -40C to +85C
    T/R
    1.24
    1.04
    0.94
    0.91
    0.90
    USB3300-EZK-TR-CAR
    32
    VQFN
    -40C to +85C
    T/R
    **
    **
    **
    **
    **
     

    ** Device not available to purchase online. Please contact a sales office for pricing information.
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    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    USB3300-EZK-CAG
    0.063600
    0.734694
    32
    VQFN
    5x5x0.9mm
    Matte Tin
    e3
    USB3300-EZK-TR
    0.063600
    0.138000
    32
    VQFN
    5x5x0.9mm
    Matte Tin
    e3
    USB3300-EZK
    0.063600
    0.734694
    32
    VQFN
    5x5x0.9mm
    Matte Tin
    e3
    USB3300-EZK-TR-CAR
    0.063600
    0.138000
    32
    VQFN
    5x5x0.9mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.